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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTadahiko Sakai, Mitsuru Ozono, Shoji Sakemi, Yoshiyuki Wada
Estimating the term…
A semiconductor device assembly and a semiconductor device are provided which both can ensure reliability after a mounting process. The semiconductor device includes a semiconductor element equipped with bumps on an electrode patterned surface thereof for external connection. In the semiconductor device mounted on a substrate in the semiconductor device assembly, a semiconductor element shaped to have a thickness ranging from 200 μm to 10 μm has reduced flexural rigidity so as to be easily deflected. In the status that the bumps are joined to corresponding circuitry electrodes on the substrate, the semiconductor element can deflect at other portions other than its surface between two adjacent bumps according to contraction and distortion of the substrate. This allows the bumps to be dislocated in a direction parallel to a surface of the semiconductor element, hence relieving stress developed by the contraction of the substrate at the joint positions between the bumps and the circuitry electrodes.
A semiconductor device comprising:
A semiconductor device assembly comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Arrangements for protection of devices: protecting against mechanical damage
Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies: shapes of semiconductor bodies
Of bump connectors: characterised by changes in properties of the bump connectors during connecting
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Term ended 12 Dec 2021 (estimated)
The present invention relates to a semiconductor device having a semiconductor element equipped with an electrode on an electrode patterned surface for external connection, and to a semiconductor assembly including a work piece having the semiconductor device mounted thereon.
As a semiconductor device assembly including a semiconductor device having a semiconductor element package, an assembly is known in which an electrode projection, e.g. a solder bump, provided on the semiconductor device are joined to a corresponding circuitry electrode of a work piece. In order to ensure reliability in the assembly after the mounting, it is necessary to reduce stress exerted on a joint at the electrode projection such as the solder bump.
In a conventional semiconductor assembly, stress is derived from a difference of respective thermal expansions between the semiconductor element and the work piece due to a change in an ambient temperature after the mounting, and the stress concentrates particularly on the joint. The thermal stress, which is repeatedly exerted at upon heat cycling, may injure the joint and thus impair the reliability after the mounting.
FIG. 1 is a perspective view of a semiconductor device assembly according to Embodiment 1 of the present invention.
FIG. 2A and FIG. 2B are cross sectional side views of the semiconductor device assembly according to Embodiment 1.
FIG. 3 is a partially cross sectional view of the semiconductor device assembly according to Embodiment 1.
Embodiment 1
FIG. 1 is a perspective view of a semiconductor device assembly according to Embodiment 1 of the present invention. FIGS. 2A and 2B are cross sectional side views of the assembly. FIG. 3 is a partially cross sectional view of the assembly.
As shown in FIG. 1, a semiconductor device 2 is mounted on a substrate 1 that constitutes a work piece. The semiconductor device 2 includes a semiconductor element 102 fabricated from a thin sheet of silicon. The lower surface (an electrode patterned surface) 102a of the semiconductor element 102 has metal bumps 3 provided thereon as electrodes for external connection. Upon having the bumps 3 joined by soldering to circuitry electrodes 1a of the substrate 1, the semiconductor device 2 is mounted to the substrate 1.