Method for producing contact chip cards with a low-cost dielectric
AssigneeGemplus
InventorLucile Dossetto
Life of this patent
Estimating the term…
Abstract
In a method for manufacturing a contact chip card, a dielectric support film is provided in the form of a strip. A metal grid which defines contact pads on the upper surface thereof and connection pads on the lower surface thereof is created. The dielectric support film is irremovably fixed on the upper surface of the metal grid in such a way that the contact pads of the grid are free. The chip is glued and connected to the connection pads of the grid, and the metal grid is cut to obtain a micromodule to be inserted in the cavity of a body of the card. In one particular embodiment, the grid is arched in order to encase the thickness of the dielectric.
Claims21
A method for manufacturing an electronic module with contacts, for a portable electronic device, comprising the steps of:
- cropping or punching a continuous metallic grid with an external face and an internal face, the metallic grid being provided with contact areas as well as areas for connection to a chip;
- supplying a low-cost dielectric support film;
- producing a middle arched zone in the metallic grid between the contact areas;
- non-removably fixing the dielectric support film on the external face of the arch, so as to at least partially encase the thickness of the dielectric support film and thereby obtain a module which is practically flat on the same side as the external face, to compensate for the loss of mechanical rigidity;
- adhering the chip to the internal face of the grid and connecting the chip to said connection areas on the grid;
- cutting out the module;
- and
- depositing a reactivable adhesive on the internal face of the grid.
A electronic module with contacts for go electronic chip support comprising;
- a continuous metallic grid with an external face and an internal face, the metallic grid having contact areas as well as areas for connection to a chip, and a middle arched zone between said contact areas;
- a low-cost dielectric support film fixed non-removably to the external face in the arched zone, so as to encase at least partially the thickness of the dielectric support film such that the module is practically flat on the side of the external face;
- a chip adhered to the internal face of the grid and connected to said connection areas;
- and
- a deposit of a reactivable adhesive on the internal face of said grid.
A method for manufacturing a portable electronic device comprising the steps of:
- cropping or punching a continuous metallic grid with an external face and an internal face, the metallic grid being provided with contact areas as well as areas for connection to a chip;
- supplying a low-cost dielectric support film;
- producing a middle arched zone in the metallic grid between the contact areas;
- non-removably fixing the dielectric support film on the external face of the arch, so as to at lest partially encase the thickness of the dielectric support film and thereby obtain a module which is practically flat on the same side as the external face, to compensate for the loss of mechanical rigidity;:
- adhering the chip to the internal face or the grid and connecting the chip to said connection area on the grid;
- cutting out the module;
- depositing a reactivable adhesive on the internal face of the grid;
- and
- attaching the module it a cavity of a card body by activation of the adhesive.
A portable electronic device including a module comprising:
- a continuous metallic grid with an external face and an internal face, the metallic grid having contact areas as well as areas for connection to a chip, and a middle arched zone between said contact areas;
- a low-cost dielectric support film fixed non-removably to the external face in the arched zone, so as to encase at least partially the thickness of the dielectric support film such that the module is practically flat on the side of the external face;
- a chip adhered to the internal face of the grid and connected to said connection areas;
- and
- a deposit of a reactivable adhesive on the internal face of said grid;
- and further including a terminal block which is practically flat with the connection grid;
- the middle zone corresponding to the dielectric film having an impression which is a logo or a design or the serial number of the electronic device.
Dependencies are inferred from the claim text.