Light emitting semiconductor device with GaInNAs active layer and GaAs spacer layers
AssigneeRicoh Company, Ltd.
InventorShunichi Sato
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AssigneeRicoh Company, Ltd.
InventorShunichi Sato
Estimating the term…
A light emitting semiconductor device, comprising: a lower cladding layer of AlzGa1-zAs (0<z≦1) alloy semiconductor layers, having a first conductivity type; a lower light guide layer of AlzGa1-zAs (0<z≦1) alloy semiconductor layers, having a band gap narrower than that of the lower cladding layer; a lower spacing layer, comprising at least one molecular layer of GaAs; a GaxIn1-xNyAs1-y (0≦x≦1 and 0<y<1) active layer, having a thickness less than the critical thickness so as not to give rise to misfit dislocations and having a band gap narrower than that of the lower light guide layer; an upper spacing layer, comprising at least one molecular layer of GaAs; an upper light guide layer of AlzGa1-zAs (0<z≦1) alloy semiconductor layers, having a band gap narrower than that of the active layer and narrower than that of the lower cladding layer; and an upper cladding layer of AlzGa1-zAs (0<z≦1) alloy semiconductor layers, having a second conductivity type, each grown on a semiconductor substrate in the order above recited.
A light emitting semiconductor device, comprising:
A light emitting semiconductor device, comprising:
Dependencies are inferred from the claim text.
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Comprising only Group III-V materials, e.g. GaP: containing nitrogen, e.g. GaN
In AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser: emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers
Having quantum effect structures or superlattices, e.g. tunnel junctions: within the light-emitting regions, e.g. having quantum confinement…
Comprising PN junctions, e.g. hetero- or double- heterostructures: incorporating bulkstrain effects, e.g. strain compensation, strain related to…
Term ended 23 Mar 2018 (estimated)
1. Field of the Invention
The present invention relates to semiconductor devices and, more particularly, to light emitting semiconductor devices having excellent carrier confinement capabilities.
2. Description of the Related Art
The present invention together with its various features and advantages, can be more easily understood from the following more detailed description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a cross-sectional view of a light emitting semiconductor device in accordance with an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a light emitting semiconductor device in accordance with another embodiment of the present invention, in which an active layer is tensile strained;
In the description which follows, specific embodiments of the present invention advantageously used in light emitting device applications are described. It is understood, however, that the present invention is not limited to these embodiments. For example, it is appreciated that the structure and methods for fabrication of light emitting semiconductor devices are adaptable to any form of semiconductor devices. Other embodiments will be apparent to those skilled in the art.
In obtaining the present invention, rigorous and extensive experimentation has been conducted with semiconductor laser devices having GaInNAs layers which are lattice-matched to, or tensile strained with, GaAs substrates provided with cladding layers. As a result, it was found to be difficult for the GaInNAs active layers to be provided directly onto the above-mentioned AlzGa1-zAs (0<z≦1) or GatIn1-tPuAs1-u (0<t<1 and 0<u≦1).
Since almost all of nitrogen-containing alloy semiconductors are in the non-miscible region in the solid solubility diagram, the growth of these alloy semiconductors are generally quite difficult by conventional crystal growth methods and a minute amount of nitrogen can be incorporated in semiconductor crystals only by non-equilibrium growth methods such as, for example, metal organic chemical vapor deposition (MOCVD) and molecular beam epitaxy (MBE).