Chip-in-glass fluorescent display device
AssigneeFutaba Corporation
InventorYoshikazu Shibuya
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AssigneeFutaba Corporation
InventorYoshikazu Shibuya
Estimating the term…
A fluorescent display device includes an anode plate and a semiconductor device arranged thereon, wherein the anode plate forms a portion of an envelope of the display device and has an anode on an inner surface thereof. The display device further includes a supporting structure and a tensioning member. The supporting structure is disposed on the anode plate and has a top plate portion overlapping the semiconductor device. The tensioning member is disposed on the top plate portion of the supporting structure and serves to arrange a plurality of filament-shaped cathodes at a pitch between the semiconductor device and the top plate portion.
A fluorescent display device including an anode plate and a semiconductor device arranged thereon, wherein the anode plate forms a portion of an envelope of the display device and has an anode on an inner surface thereof, the display device comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
Light sources with substantially two-dimensional [2D] radiating surfaces: characterised by the composition or arrangement of the conductive…
Packages: interconnections, e.g. lead-frames, bond wires or solder balls
Electric heating
Inorganic light-emitting semiconductor devices having potential barriers
Term ended 5 Jun 2022 (estimated)
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The present invention relates to a chip-in-glass fluorescent display device having a semiconductor device disposed inside an envelope thereof; and, more particularly, to a semiconductor device built-in fluorescent display device having a semiconductor device arranged in a space under a supporting member of filament-shaped cathodes.
Generally, a chip-in-glass fluorescent display device includes a semiconductor device such as an integrated circuit (IC) usually incorporating therein a drive circuit and a control circuit, wherein the semiconductor device is installed inside a highly vacuumed envelope of the display device. Such a chip-in-glass fluorescent display device is advantageous in that a module employing the display device can be small-sized and the circuit thereof rarely needs wirings for an external connection.
However, the semiconductor device installed inside the envelope of the above-mentioned fluorescent display device forms a dead space on a display area (i.e., an area for anodes), thereby reducing the display area. In addition, ultraviolet and visible rays incident from an exterior may cause an erroneous operation of the semiconductor device.
The above and other objects and features of the present invention will become apparent from the following description of preferred embodiments given in conjunction with the accompanying drawings, in which:
FIGS. 1A and 1B provide sectional views of a chip-in-glass fluorescent display device according to the prior art;
FIGS. 2A and 2B depict sectional views of a chip-in-glass fluorescent display device in accordance with a preferred embodiment of the present invention; and
Referring now to FIGS. 2A, 2B, and 3, a chip-in-glass fluorescent display device in accordance with a preferred embodiment of the present invention will be described in detail. Like numerals represent like parts in the drawings.
FIGS. 2A and 2B depict sectional views of a chip-in-glass fluorescent display device in accordance with the preferred embodiment of the present invention and FIG. 3 shows a perspective view thereof.
The chip-in-glass fluorescent display device includes a box-shaped envelope 1 having a highly vacuumed inside. The envelope 1 has an anode plate 2, an upper plate 3, and side plates 4, each being made of a glass substrate. The upper plate 3 is spaced apart from the anode plate 2 with a certain gap interposed therebetween. Each of the side plates 4 is hermetically sealed along side edges of the upper plate 3 and the anode plate 2 by applying a sealant therebetween.