Multi-lens type electrostatic lens, electron beam exposure apparatus and charged beam applied apparatus using the lens, and device manufacturing method using these apparatuses
AssigneeCanon Kabushiki Kaisha
InventorMasahiko Okunuki
Life of this patent
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Abstract
Each of a plurality of electrostatic lens has inner walls of a plurality of lens apertures, which are formed by an electrode laid out around each beam axis, and high-resistance portions which are bonded to the electrode and are laid out on two sides of the electrode in the beam axis direction, and a low-resistance portion which is bonded to the high-resistance portions on a side opposite to the electrode in the beam axis direction.
Claims18
A multi-lens comprising:
- a substrate which is formed by stacking high-resistance substrates each having a plurality of lens apertures, an inner wall of which is formed by a resistance portion along a beam axis of a beam emitted by a beam source, and which has an electrode bonded around the plurality of lens apertures between the high-resistance substrates;
- and
- electrode substrates having apertures corresponding to the plurality of lens apertures, wherein the electrode substrates are bonded to two surfaces of said substrate,
- wherein a resistance of at least one of said electrode substrates is lower than a resistance of said resistance portion.
An electron beam lithography apparatus for directly writing a pattern on a substrate with an electron beam, comprising:
- a substrate which is formed by stacking high-resistance substrates each having a plurality of lens apertures, an inner wall of which is formed by a resistance portion along a beam axis of a beam emitted by an electron beam source, and which has an electrode bonded around the plurality of lens apertures between the high-resistance substrates;
- and
- electrode substrates having apertures corresponding to the plurality of lens apertures, wherein the electrode substrates are bonded to two surfaces of said, and
- wherein a resistance of at least one of said electrode substrates is lower than a resistance of said resistance portion.
A charged beam applied apparatus for processing using a charged beam, comprising:
- a substrate which is formed by stacking high-resistance substrates each having a plurality of lens apertures, an inner wall of which is formed by a resistance portion along a beam axis of a beam emitted by a charged beam source, and which has an electrode bonded around the plurality of lens apertures between the high-resistance substrates;
- and
- electrode substrates having apertures corresponding to the plurality of lens apertures, wherein the electrode substrates are bonded to two surfaces of said substrate, and
- wherein a resistance of at least one of said electrode substrates is lower than a resistance of said resistance portion.
A method of manufacturing a device, comprising:
- a step of applying a resist on a substrate;
- a step of directly writing a pattern on the substrate using an electron beam lithography apparatus;
- and
- a development step of developing the substrate,
- said electron beam lithography apparatus comprising:
- a substrate which is formed by stacking high-resistance substrates each having a plurality of lens apertures, an inner wall of which is formed by a resistance portion along a beam axis of a beam emitted by an electron beam source, and which has an electrode bonded around the plurality of lens apertures between the high-resistance substrates;
- and
- electrode substrates having apertures corresponding to the plurality of lens apertures, wherein the electrode substrates are bonded to two surfaces of said substrate, and
- wherein a resistance of at least one of said electrode substrates is lower than a resistance of said first resistance portion.
A method of manufacturing a device, comprising:
- a step of applying a resist on a substrate;
- a step of directly writing a pattern on the substrate using a charged beam applied apparatus;
- and
- a development step of developing the substrate,
- said charged beam applied apparatus comprising:
- a substrate which is formed by stacking high-resistance substrates each having a plurality of lens apertures, an inner wall of each of which is formed by a resistance portion along a beam axis of a beam emitted by an electron beam source, and which has an electrode bonded around the plurality of lens apertures between the high-resistance substrates;
- and
- electrode substrates having apertures corresponding to the plurality of lens apertures, wherein the electrode substrates are bonded to two surfaces of said substrate,
- wherein a resistance of at least one of said electrode substrates is lower than a resistance of said first resistance portion.
An electrostatic lens comprising:
- a substrate which is formed by stacking high-resistance substrates each having a lens aperture, an inner wall of which is formed by a resistance portion along a beam axis of a beam emitted by a beam source, and which has an electrode bonded around the lens aperture between the high-resistance substrates;
- and
- electrode substrates having an aperture corresponding to the lens aperture, wherein the electrode substrates are bonded to two surfaces of said substrate, and
- wherein a resistance of at least one of said electrode substrates is lower than a resistance of said resistance portion.
A multi-lens comprising:
- a plurality of electrode substrates, each of which is formed with a plurality of apertures;
- and
- substrates having apertures corresponding to the plurality of lens apertures, wherein the substrates are sandwiched by the plurality of electrode substrates,
- wherein the substrates have a relieve function of relieving a charge loaded to the substrates by striking an electron or charged particle to a side wall of the plurality of lens apertures.
Dependencies are inferred from the claim text.