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US 6,617,528 B2Granted
Electronic package with stacked connections and method for making same
AssigneeInternational Business Machines Corporation
InventorsGregg J. Armezzani, Matthew A. Heller
Life of this patent
Estimating the term…
Abstract
An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.
Claims11
An electronic package comprising:
- a first flexible circuitized substrate having at least one conductive aperture therein having an external surface;
- a second flexible circuitized substrate having at least one conductive aperture therein having an external surface, said first and second flexible circuitized substrates aligned such that said at least one conductive aperture of said first flexible circuitized substrate is substantially aligned with said at least one conductive aperture of said second flexible circuitized substrate wherein said first and second flexible circuitized substrates are comprised of a material selected from the group consisting of polyimide, polytetrafluoroethylene, and epoxy glass cloth, said at least one conductive aperture of said first flexible circuitized substrate and said at least one conductive aperture of said second flexible circuitized substrate including a conductive metallic layer thereon selected from the group consisting of copper, nickel, gold, chromium, solder and alloys thereof;
- and
- at least one solder member including a first contact portion extending from said external surface of said conductive aperture of said first flexible circuitized substrate and a second contact portion extending substantially within both of said aligned conductive apertures of said and second flexible circuitized substrates to said external surface of said conductive aperture of said second flexible circuitized substrates so as to substantially form a solder dome thereon and secure said flexible circuitized substrates together.
1 more element
A single chip carrier comprising:
- a first circuitized substrate having at least one conductive aperture therein having an eternal surface;
- a second circuitized substrate having at least one conductive aperture therein having an external surface, said first and second circuitized substrates aligned such that said at least one conductive aperture of said first circuitized substrate is substantially aligned with said at least one conductive aperture of said second circuitized substrate, said at least one conductive aperture of said first circuitized substrate and said at least one conductive aperture of said second circuitized substrate including a conductive metallic layer thereon selected from the group consisting of copper, nickel, gold, chromium, solder and alloys thereof;
- at least one solder member including a first contact portion for connection to a printed circuit board extending from said external surface of said conductive aperture of said first circuitized substrate and a second contact portion extending substantially within both of said aligned conductive apertures of said first and second circuitized substrates to said external surface of said conductive aperture of said second circuitized substrate so as to substantially form a solder dome thereon to secure said circuitized substrates together wherein said second contact portion of said solder member is at least one of an array of solder members on said external surface of said conductive aperture of said second circuitized substrate;
- and
- at least one chip attached to said array of solder members.
2 more elements
Dependencies are inferred from the claim text.