Back to results
US 6,617,521 B1Granted
Circuit board and display device using the same and electronic equipment
AssigneeSeiko Epson Corporation
InventorsHideya Saito, Kogo Endo
Life of this patent
Estimating the term…
Abstract
A circuit board is manufactured by forming an input wiring 420a, an output wiring 420b, and dummy wiring layer 422 in an IC chip mounting area on a base film 410 having insulation and flexibility without using an adhesive layer, and mounting an IC chip 450 on an intervening anisotropic conductive film of an adhesive resin 19 into which electrically conductive particles 21 are dispersed. The dummy wiring layer 422 is electrically isolated from the input wiring 420a, the output wiring 420b, and IC chip electrodes 450a and 450b, and has a plurality of openings 422a.
Claims37
A circuit board comprising:
- a wiring board including a base material having insulation, and a plurality of board-side terminals arranged on the base material, and
- a semiconductor chip, mounted on the wiring board, having a plurality of semiconductor-side terminals, the semiconductor-side terminals disposed along a periphery of the semiconductor chip and electrically connected to the board-side terminals,
- wherein the wiring board includes a dummy wiring layer;
- and
- wherein the dummy wiring layer is formed as a member having at least one recess formed on a top surface of said member, the dummy wiring layer being disposed inwardly from the board-side terminals and between the semiconductor chip and the wiring board.
2 more elements
A circuit board comprising:
- a base;
- a plurality of base terminals formed on said base;
- a dummy wiring layer formed on said base interior of said base terminals;
- wherein the dummy wiring layer is formed as a member having at least one recess formed on a top surface of said member;
- a chip mounted to said base over said dummy wiring layer;
- and
- a plurality of chip terminals formed on said chip, said chip terminals being connected to said base terminals.
4 more elements
A circuit board comprising:
- a semiconductor chip including a plurality of chip terminals;
- a base being pervious to moisture and including a plurality of base terminals, each base terminal being connected to the respective chip terminal;
- and
- a dummy wiring layer being formed as a member having a plurality of grooves formed therein, wherein the dummy wiring layer is disposed inwardly from the base terminals and between the semiconductor chip and the base so as to prevent moisture from reaching the semiconductor chip through the base.
1 more element
A circuit board comprising:
- a semiconductor chip including a plurality of chip terminals;
- a base being selected from the group consisting of polyimide, polyethylene terephtalate and polyester, and including a plurality of base terminals, each base terminal being connected to the respective chip terminal;
- and
- a dummy wiring layer including copper film formed as a member having a plurality of grooves formed therein, the dummy wiring layer disposed inwardly from the base terminals and between the semiconductor chip and the base.
1 more element
A display device comprising:
- a scanning line;
- a data line intersecting with the scanning line;
- an electrode, at least one of the scanning line and the data line being connectable thereto;
- a substrate where the electrode is formed;
- a base bonded with the substrate, being pervious to moisture, and including a plurality of base terminals;
- a semiconductor chip supplying at least one of a data signal and a scanning signal to the electrode, the semiconductor chip including a plurality of chip terminals, each base terminal being connected to the respective chip terminal;
- and
- a dummy wiring layer being an impervious member having a plurality of grooves formed therein, the dummy wiring layer disposed inwardly from the base terminals and between the semiconductor chip and the base so as to prevent moisture from reaching the semiconductor chip through the base.
5 more elements
A liquid crystal device comprising:
- a pair of substrates;
- a liquid crystal disposed between the pair of substrates;
- a first electrode formed to one of the pair of substrates;
- a second electrode formed to the other of the pair of substrates;
- a base connected to one of the pair of substrates, being permeable to moisture, and including a plurality of base terminals;
- a semiconductor chip including a plurality of chip terminals and supplying a voltage to at least one of the first and the second electrodes, each base terminal being connected to the respective chip terminal;
- and
- a dummy wiring layer being an impermeable member having a plurality of grooves formed therein and disposed inwardly from the base terminals and between the semiconductor chip and the base so as to prevent moisture from reaching the semiconductor chip through the base.
5 more elements
Dependencies are inferred from the claim text.