Arrangement relating to conductor carriers and methods for the manufacture of such carriers

An arrangement comprising:

• at least one earth plane as a carrying base part and first electric conductors which form a first conductor structure;
• a first capacitive coupling existing between two mutually adjacent the first conductors and a second capacitive coupling existing between each of the first conductors and the earth plane;
• and
• a second conductor structure having second conductors comprised of a conductive material which is applied directly onto said earth plane and that extends slightly above said earth plane;
• wherein the first and the second conductor structures are disposed in such a manner that respective conductors of the first conductor structure overlap mutually opposite respective conductors of the second conductor structure in respect of their cross-directions, and in that a first dielectric material having a dielectric index εr1 is disposed between the first and second conductor structures.