Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
AssigneeGeneral Electric Company
InventorsGary William Yeager, Malgorzata Iwona Rubinsztajn
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Abstract
Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.
Claims35
A curable epoxy resin composition for encapsulation of a solid state device, which comprises:
- (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst, wherein component (A) is present at a level of greater than about 60% by weight based on the combined weight of components (A), (B), (C), (D), and (E);
- component (C) is present at a level in a range of between about 1% by weight and about 6% by weight based on the combined weight of components (A), (B), (C), (D), and (E);
- component (D) is present at a level in a range of between about 1% by weight and about 6% by weight based on the combined weight of components (A), (B), (C), (D), and (E);
- component (E) is present at a level in a range of between about 0.01% by weight and about 10% by weight based on the combined weight of components (A), (B), (C), (D), and (E);
- and the molar ratio of component (B) to component (A) is less than about 0.58.
A curable epoxy resin composition for encapsulation of a solid state device, which comprises:
- (A) 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, (B) hexahydrophthalic anhydride, (C) trimethoxyboroxine, and (D) 2,5-hexanediol and triphenylphosphite, wherein component (A) is present at a level of greater than about 60% by weight based on the combined weight of components (A), (B), (C), and (D);
- component (C) is present at a level in a range of between about 1% by weight and about 6% by weight based on the combined weight of components (A), (B), (C), and (D);
- component (D) is present at a level in a range of between about 1% by weight and about 6% by weight based on the combined weight of components (A), (B), (C), and (D);
- and the molar ratio of component (B) to component (A) is less than about 0.37.
A curable epoxy resin composition for encapsulation of a solid state device, which comprises:
- (A) 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, (B) hexahydrophthalic anhydride, (C) trimethoxyboroxine, (D) 2,5-hexanediol and triphenylphosphite, and (E) stannous octoate, wherein component (A) is present at a level of greater than about 60% by weight based on the combined weight of components (A), (B), (C), (D), and (E);
- component (C) is present at a level in a range of between about 1% by weight and about 6% by weight based on the combined weight of components (A), (B), (C), (D), and (E);
- component (D) is present at a level in a range of between about 1% by weight and about 6% by weight based on the combined weight of components (A), (B), (C), (D), and (E);
- component (E) is present at a level in a range of between about 0.05% by weight and about 5% by weight based on the combined weight of components (A), (B), (C), (D), and (E);
- and the molar ratio of component (B) to component (A) is less than about 0.58.
Dependencies are inferred from the claim text.