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US 6,617,399 B2Granted
Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners
AssigneeHenkel Loctite Corporation
InventorMark M. Konarski
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Abstract
Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combination of nitrogen containing compounds and transition metal complexes, and a polysulfide toughening agent.
Claims12
A thermosetting resin composition, said composition comprising:
- (a) an epoxy resin component;
- (b) an adhesion promoter component having at least two secondary amine functional groups;
- (c) a curative based on the combination of a nitrogen-containing compound and a transition metal complex;
- and
- (d) a polysulfide-based toughening agent.
2 more elements
A thermosetting resin composition, said composition consisting essentially of:
- (a) an epoxy resin component;
- (b) an adhesion promoter component having at least two secondary amine functional groups;
- (c) a curative based on the combination of a nitrogen-containing compound and a transition metal complex;
- and
- (d) a polysulfide-based toughening agent.
2 more elements
Dependencies are inferred from the claim text.