Pattern forming method for flattening an organic film for a liquid crystal display device
AssigneeNEC LCD Technologies, Ltd.
InventorShusaku Kido
Life of this patent
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Abstract
An organic film is coated on an insulating substrate and an organic solvent is infiltrated into the organic film to cause dissolution of the organic film to flatten the organic film. Thereafter, the flattened organic film is subjected to heat treatment at temperatures of 100 to 180° C. to evaporate the organic solvent included in the organic film. Evaporating the organic solvent included in the organic film at relatively low temperatures, i.e., temperatures of 100 to 180° C. makes it possible to reduce thermal stress on a wiring layer covered by the organic film and provide flatness of the surface of the insulating substrate.
Claims13
A method for flattening an organic film, comprising the steps of:
- forming an organic film on a surface of an insulating substrate;
- infiltrating an organic solvent into said organic film;
- and
- causing dissolution of said organic film to flatten said organic film.
A method for manufacturing a liquid crystal display device, said liquid crystal display device being formed by disposing a TFT substrate and an opposing substrate facing each other and interposing a liquid crystal said TFT substrate and said opposing substrate, said TFT substrate being formed by the steps of:
- forming a gate line and a gate electrode on a first substrate;
- forming a gate insulating film covering said gate line and said gate electrode on said first substrate;
- forming a semiconductor film on said gate insulating film and then, forming a source/drain electrode on said semiconductor film to connect said source/drain electrode to said semiconductor film;
- forming a protective film covering said semiconductor film and said source/drain electrode on said gate insulating film;
- and
- forming a flattened film on said protective film,
- said step for forming a protective film being performed such that an organic film is coated on said protective film and an organic solvent is infiltrated into said organic film to cause dissolution of said organic film.
A method for flattening an organic film, comprising the sequential steps of:
- forming an organic film on a surface of an insulating substrate;
- after forming said organic film, infiltrating an organic solvent into said organic film;
- and
- causing dissolution of said organic film to flatten said organic film.
Dependencies are inferred from the claim text.