Method of manufacturing semiconductor device prevented from peeling of wirings from insulating film
AssigneeNEC Electronics Corporation
InventorsTakayuki Abe, Yasuhide Den
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Abstract
The present invention provides a manufacturing method of a semiconductor device which does not give rise to peeling of a metal film caused by oxygen held in a interlayer insulating film even when the wafer is subjected to a heat treatment after the metal film is formed on the interlayer insulating film. After the formation of the interlayer insulating film, oxygen held in the interlayer insulating film is removed from the interlayer insulating film, then a metal film on the interlayer insulating film.
Claims15
A method of manufacturing a semiconductor device, comprising:
- forming an insulating film over a semiconductor substrate, oxygen being introduced into said insulating film during formation of said insulating film;
- removing said oxygen from said insulating film by an annealing treatment to provide an oxygen-removed insulating film;
- forming a metal film on said oxygen-removed insulating film;
- and
- performing a heat treatment after formation of said metal film,
- wherein said annealing treatment is performed at a temperature which is not lower than said heat treatment, and said heat treatment includes forming a silicon nitride film over said metal film at a temperature in the range of 700 to 800° C.
A method of manufacturing a semiconductor device comprising:
- providing a memory cell region and a peripheral circuit region and forming a first transistor as a memory cell transistor in said memory cell region and a second transistor as a peripheral circuit element in said peripheral circuit region, respectively;
- forming a first insulating film that covers said first and second transistor;
- forming a first contact hole reaching an impurity diffusion region of said first transistor in said first insulating film;
- filling said first contact hole with a first plug layer which comprises a silicon film;
- forming a second insulating film that covers said first insulating film and said first plug layer;
- ion implanting desired impurities to said first plug layer for the purpose of reducing the resistance of the first plug layer;
- performing an annealing treatment to activate said impurities and remove oxygen held in said first and second insulating films at the same time;
- forming a second contact hole reaching said first plug of said second insulating film;
- forming a third contact hole reaching an impurity diffusion region of said second transistor in said second and first insulating film;
- filling said second contact hole with a second plug layer as well as filling a third contact hole with a third plug layer;
- forming a metal film on said second insulating film and said second and third plug layers;
- and
- forming a bit line connected to said second plug layer and a wiring connected to said third plug layer by patterning said metal film.
A method of manufacturing a semiconductor device, comprising:
- forming a first insulating film over a semiconductor substrate;
- forming a metal film on said first insulating film;
- and
- forming a second insulating film on said metal film at a first temperature,
- wherein annealing treatment is performed on said first insulating film before said metal film is formed, said annealing treatment being carried out at a second temperature which is not lower than said first temperature, and
- wherein said second insulating film is used as a mask for selectively etching said metal film to form a wiring layer.
Dependencies are inferred from the claim text.