System and method for fabricating a semiconductor device
AssigneeSeiko Epson Corporation
InventorMasaaki Sone
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Abstract
The present invention provides a semiconductor device that makes it possible to expose the back side of a die pad as well as a method for fabricating the same. The semiconductor device can include a lead frame that has portions to be sandwiched by first and second molds and a die pad that is down set at a distance greater than the depth of a recessed part of the first mold. The die pad is placed on the bottom of the recessed part of the first mold and the lead frame is disposed so that the portions to be sandwiched are suspended above the first mold. The molding process is carried out as the second mold presses the portions of the lead frame to be sandwiched in the direction of the first mold.
Claims7
A method for fabricating a semiconductor device including a molding process, the molding process comprising:
- setting a lead frame between a first mold and a second mold, the lead frame having portions to be sandwiched between the first and second molds and a die pad that is down set at a distance greater than a depth of a recessed part of said first mold, and the lead frame being set by placing the die pad on the bottom of the recessed part of the first mold so that the portions to be sandwiched are suspended above the first mold;
- and
- urging the first and second molds together to press the portions to be sandwiched in the direction of the first mold.
Dependencies are inferred from the claim text.