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US 6,617,199 B2Granted
Electronic device having fibrous interface
AssigneeHoneywell International Inc.
InventorsCharles Smith, Michael M. Chau, Roger A. Emigh, Nancy F. Dean
Life of this patent
Estimating the term…
Abstract
Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
Claims21
A method of making a semiconductor assembly by:
- combining an encapsulant with a plurality of thermally conductive fibers, individual fibers having a length and two ends and the encapsulant having a thickness;
- encapsulating a portion of the individual lengths of the plurality of fibers, an average distance between the ends of the individual encapsulated fibers being greater than an average thickness of the encapsulant along the fiber lengths of the plurality of fibers;
- and
- forming a thermally conductive composite from the encapsulant and the fibers;
- wherein the improvement comprises:
- interposing the thermally conductive composite between a semiconductor die and a substrate.
3 more elements
A method of making a semiconductor assembly by:
- combining an encapsulant with a plurality of thermally conductive fibers, individual fibers having a length and two ends and the encapsulant having a thickness;
- encapsulating a portion of the individual lengths of the plurality of fibers, an average distance between the ends of the individual encapsulated fibers being greater than an average thickness of the encapsulant along the fiber lengths of the plurality of fibers;
- and
- forming thermally conductive composite material from the encapsulant and the fibers;
- wherein the improvement comprises:
- providing a semiconductor package having a lid, a semiconductor die disposed in the package, and a heat sink;
- and
- interposing thermally conductive composite material between the lid and the heat sink.
5 more elements
A method of making a semiconductor assembly by:
- combining a gel encapsulant with a plurality of thermally conductive fibers, individual fibers having a length;
- encapsulating at least a portion of the individual lengths of the plurality of fibers;
- and
- forming a thermally conductive composite from the encapsulant and the fibers;
- wherein the improvement comprises:
- interposing the thermally conductive composite between a semiconductor die and a substrate.
3 more elements
A method of making a semiconductor assembly by:
- combining a gel encapsulant with a plurality of thermally conductive fibers, individual fibers having a length;
- encapsulating at least a portion of the individual lengths of the plurality of fibers;
- and
- forming thermally conductive composite material from the encapsulant and the fibers;
- wherein the improvement comprises:
- providing a semiconductor package having a lid, a semiconductor die disposed in the package, and a heat sink;
- and
- interposing thermally conductive composite material between the lid and the heat sink.
5 more elements
A method of making a semiconductor assembly by:
- embedding a plurality of thermally conductive fibers in a support material, the support material having a first surface and a second opposing surface and the fibers having first portions that extend upwardly out of the second opposing surface of the support material;
- applying an encapsulant between the first portions of the fibers and over the support material, the support material, encapsulant, and fibers forming a thermally conductive composite;
- and
- forming a third surface defining an outermost surface of the thermally conductive composite except for the fiber first portions terminating in tips that are elevationally above the third surface and the encapsulant;
- wherein the improvement comprises:
- applying the first surface to one of a semiconductor die or a lid;
- and
- applying the fiber tips elevationally above the third surface to the other of the semiconductor die or the lid.
5 more elements
A method of making a semiconductor assembly by:
- embedding a plurality of thermally conductive fibers in a support material, the support material having a first surface and a second opposing surface and the fibers having first portions that extend upwardly out of the second opposing surface of the support material;
- applying an encapsulant between the first portions of the fibers and over the support material, the support material, encapsulant, and fibers forming a thermally conductive composite material;
- and
- forming a third surface defining an outermost surface of the thermally conductive composite material except for the fiber first portions terminating in tips that are elevationally above the third surface and the encapsulant;
- wherein the improvement comprises:
- providing a semiconductor package having a lid, a semiconductor die disposed in the package, and a heat sink;
- and
- interposing thermally conductive composite material between the lid and the heat sink.
5 more elements
A method of making a semiconductor assembly by:
- combining an encapsulant with a plurality of straight, thermally conductive fibers, individual fibers having a length and the encapsulant having a thickness;
- encapsulating a portion of the individual lengths of the plurality of fibers, an average length of the straight, encapsulated fibers being greater than an average thickness of the encapsulant along the fiber lengths of the plurality of fibers;
- and
- forming a thermally conductive composite from the encapsulant and the fibers;
- wherein the improvement comprises:
- interposing the thermally conductive composite between a semiconductor die and a substrate.
3 more elements
A method of making a semiconductor assembly by:
- combining an encapsulant with a plurality of straight, thermally conductive fibers, individual fibers having a length and the encapsulant having a thickness;
- encapsulating a portion of the individual lengths of the plurality of fibers, an average length of the straight, encapsulated fibers being greater than an average thickness of the encapsulant along the fiber lengths of the plurality of fibers;
- and
- forming thermally conductive composite material from the encapsulant and the fibers;
- wherein the improvement comprises:
- providing a semiconductor package having a lid, a semiconductor die disposed in the package, and a heat sink;
- and
- interposing thermally conductive composite material between the lid and the heat sink.
5 more elements
Dependencies are inferred from the claim text.