Thermosetting resin composition and semiconductor device using the same
AssigneeNitto Denko Corporation
InventorsHiroshi Noro, Mitsuaki Fusumada
Life of this patent
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Abstract
A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconductor element, and the thermosetting resin composition mentioned above, wherein a gap formed between the printed circuit board and the semiconductor element is sealed by the thermosetting resin composition; and a process for manufacturing the semiconductor device.
Claims9
A sheet-like thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure, comprising a compound having the general formula (1):
- R1—(COO—CH(CH3)—O—R2)n (1)
- wherein n is a positive integer;
- R1 is a monovalent or higher polyvalent organic group;
- and R2 is a monovalent organic group, wherein R1 and R2 may be identical or different, or
- a compound having the general formula (2):
- CH2═CH—O—R4—O—CH(CH3)—[OCO—R3—COO—CH(CH3)—O—R4—O—CH(CH3)]n—OCO—R3—COO—CH(CH3)—O—R4—O—CH═CH2 (2)
- wherein n is a positive integer;
- each of R3 and R4 is a divalent organic group, wherein R3 and R4 may be identical or different.
A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure, comprising:
- an epoxy resin,
- a phenolic resin-based curing agent and
- a compound having the general formula (1):
- R1—(COO—CH(CH3)—O—R2)n (1)
- wherein n is a positive integer;
- R1 is a monovalent or higher polyvalent organic group;
- and R2 is a monovalent organic group, wherein R1 and R2 may be identical or different, or
- a compound having the general formula (2):
- CH2═CH—O—R4—O—CH(CH3)—[OCO—R3—COO—CH(CH3)—O—R4—O—CH(CH3)]n—OCO—R3—COO—CH(CH3)—O—R4—O—CH═CH2 (2)
- wherein n is a positive integer;
- each of R3 and R4 is a divalent organic group, wherein R3 and R4 may be identical or different.
A thermosetting resin composition comprising:
- an epoxy resin,
- an acid anhydride-based curing agent and
- a compound having the general formula (1):
- R1—(COO—CH(CH3)—O—R2)n (1)
- wherein n is a positive integer;
- R1 is a monovalent or higher polyvalent organic group;
- and R2 is a monovalent organic group, wherein R1 and R2 may be identical or different, or
- a compound having the general formula (2):
- CH2═CH—O—R4—O—CH(CH3)—[OCO—R3—COO—CH(CH3)—O—R4—O—CH(CH3)]n—OCO—R3—COO—CH(CH3)—O—R4—O—CH═CH2 (2)
- wherein n is a positive integer;
- each of R3 and R4 is a divalent organic group,
- wherein R3 and R4 may be identical or different, and
- wherein the thermosetting resin composition is liquid at 25° C.
A thermosetting resin composition comprising:
- (A) an epoxy resin having at least two epoxy groups in its molecule,
- (B) a curing agent,
- (C) a compound having the general formula (1):
- R1—(COO—CH(CH3)—O—R2)n (1)
- wherein n is a positive integer;
- R1 is a monovalent or higher polyvalent organic group;
- and R2 is a monovalent organic group, wherein R1 and R2 may be identical or different, or
- a compound having the general formula (2):
- CH2═CH—O—R4—O—CH(CH3)—[OCO—R3—COO—CH(CH3)—O—R4—O—CH(CH3)]n—OCO—R3—COO—CH(CH3)—O—R4—O—CH═CH2 (2)
- wherein n is a positive integer;
- each of R3 and R4 is a divalent organic group, wherein R3 and R4 may be identical or different;
- and
- (D) a microcapsulated curing accelerator comprising a core portion comprising a curing accelerator, and a shell portion formed so as to cover the core portion, the shell portion comprising a polymer having a structural unit represented by a general formula (3):
- —N(R5)—CO—N(R6)— (3)
- wherein each of R5 and R6 is hydrogen atom or a monovalent organic group, wherein R5 and R6 may be identical or different,
- wherein the thermosetting resin composition has a reaction exothermic peak of 180° to 250° C. with a programming rate of 10° C./min in the differential scanning calorimetric determination.
Dependencies are inferred from the claim text.