US 6,617,021 B2Granted

Adhesive composition and adhesive sheet for semiconductor devices

AssigneeTomoegawa Paper Co., Ltd.

InventorsMasaharu Kobayashi, Osamu Oka, Yasuhiro Yoshii

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Abstract

An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.

Claims9

Dependent claims

An adhesive composition for semiconductor devices, comprising (A) epoxy resin, (B) phenolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound.

Dependencies are inferred from the claim text.

Facts

Application: 10/068,945Filed 11 Feb 2002
Priority: JP P2001-03765714 Feb 2001
Published: US 2002/0155286 A124 Oct 2002
Granted: 9 Sep 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification35 codes

C09J 163/08
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins: epoxidised polymerised polyenes
C08G 59/504
Amines: containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
C08L 53/025
Of vinyl-aromatic monomers and conjugated dienes: modified
C08L 61/04
Compositions of condensation polymers of aldehydes or ketones ; Compositions of derivatives of such polymers: condensation polymers of aldehydes…

Family

US 2002/0155286 A1Pre-grant publication · published 24 Oct 2002
US 6,617,021 B2This patent

From the US filing history. Foreign family members aren’t listed.

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