US 6,616,999 B1Granted

Preapplicable phase change thermal interface pad

OwnerRaymond G. Freuler, Gary E. Flynninventors

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Abstract

A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a portion of which extends beyond the interface mating surface between the electronic component and heat sink. Formed upon opposed sides, of the substrate are layers of thermally conductive compositions, which preferably comprise certain novel graphitic allotrope compounds. The thermal interface further includes an adhesive deposited upon such portion of the peripheral edge extending beyond the mating surface between the electronic component and heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer at the mating juncture between the electronic component and the heat sink.

Claims14

Dependent claims

A thermal interface positionable at a juncture between an electronic component and a heat sink for facilitating heat transfer from said electronic component to said heat sink comprising:

a) a generally planar substrate consisting essentially of a single layer having first and second surfaces and defining a first continuous peripheral edge, said peripheral edge having a portion thereof extending beyond the juncture between said electronic component and said heat sink;
b) a first layer of a beat conductive composition formed substantially about said first surface of said substrate, and a second layer of a heat conductive composition formed substantially about said second surface of said substrate, said first and second layers further being formed upon said portion of said substrate extending beyond said juncture between said electronic component and said beat sink, said heat conductive composition comprising:
i) 60% to 90% by weight of paraffin;
and
ii) 10% to 40% by weight of graphite;
wherein said heat conductive composition has a melting point of approximately 51° C.;
and
c) a layer of adhesive formed upon a portion of a respective one of said layers of heat conductive material, said adhesive layer being localized upon said portion of said peripheral edge defined by said generally planar substrate extending beyond said juncture between said electronic component and said heat sink.

5 more elements

Dependencies are inferred from the claim text.