US 6,616,984 B1 · Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl

Abstract

A process of forming vias in a composition comprising (a) applying a layer of a composition containing (i) a cyanate ester, (ii) a bismaleimide, (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one aryl moiety, R1 is at least one unsaturated aliphatic moiety and R2 is at least one glycidyl moiety, (iv) an epoxy resin and, optionally, (v) a free-radical initiator; (b) covering the layer with a mask having windows through which radiation can be transmitted; (c) exposing part of the composition to radiation to at least partially cure it in the exposed areas; (d) removing the non-cured portions of the composition; and (e) completing the cure of the resin compositions.

Claims24

Dependent claims

A process of forming vias in a polymer composition comprising the steps of:

(a) applying a layer of a resin composition that comprises
(i) a cyanate ester;
(ii) a bismaleimide;
(iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one aryl moiety, R1 is at least one unsaturated aliphatic moiety, R2 is at least one glycidyl moiety;
(iv) an epoxy resin;
and
(v) a radiation triggered free-radical initiator;
(b) covering the layer of resin composition with a mask having windows through which radiation can be transmitted;
(c) exposing part of the resin composition to radiation to at least partially cure the resin composition in exposed areas;
(d) removing non-cured portions of the resin composition;
and
(e) completing the cure of the resin composition.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/907,014Filed 16 Jul 2001 · division

Priority

10 Oct 1997

Granted

9 Sep 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

C08G 59/226
Di-epoxy compounds: mixtures of di-epoxy compounds
C08G 59/36
Epoxy compounds containing three or more epoxy groups: together with mono-epoxy compounds
C08G 59/38
Epoxy compounds containing three or more epoxy groups: together with di-epoxy compounds
C08G 59/4014
Curing agents not provided for by the groups C08G59/42 - C08G59/66: nitrogen containing compounds

Family

Application08/949,204Parent of this continuation-in-part · filed 10 Oct 1997

Application08/949,214Parent of this continuation-in-part · filed 10 Oct 1997

Application60/135,356Us provisional application · filed 21 May 1999

Application09/346,001Parent of this division · filed 30 Jun 1999

Application09/346,001Parent of this continuation-in-part

US 6,616,984 B1This patent

From the US filing history. Foreign family members aren’t listed.

Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl

Life of this patent

Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl

Life of this patent

Abstract

Claims24