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US 6,616,954 B1Granted
Solvent released encapsulated yeast
AssigneeBalchem Corporation
InventorsVernetta L. Dally, David E. Martin, Carl J. Pacifico, Paul H. Richardson
Life of this patent
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Abstract
The present invention is an encapsulated yeast composite comprising a core comprising yeast and a soluble coating comprising polyethylene glycol having a molecular weight less than 3050. The yeast includes Saccharomyces cerevisiae. The encapsulated composites are useful in the production of food compositions and food products.
Claims46
An encapsulated yeast composite comprising:
- (a) a core which comprises yeast;
- and
- (b) a coating which comprises a soluble coating comprising polyethylene glycol having a molecular weight less than 3050.
A food composition comprising an encapsulated yeast composite which comprises:
- (a) a core comprising yeast;
- and
- (b) a coating which comprises a soluble coating comprising polyethylene glycol having a molecular weight less than 3050.
A method for preparing a food product comprising:
- (a) combining an encapsulated yeast composite, which comprises a core comprising yeast and a coating which comprises a soluble coating comprising polyethylene glycol having a molecular weight less than 3050, with other food ingredients;
- and
- (b) subjecting said combination from step (a) to an aqueous solvent which releases said yeast.
A food product prepared according to a method comprising:
- (a) combining an encapsulated yeast composite, which comprises a core comprising yeast and a coating which comprises a soluble coating comprising polyethylene glycol having a molecular weight less than 3050, with other food ingredients;
- and
- (b) subjecting said combination from step (a) to an aqueous solvent which releases said yeast.
Dependencies are inferred from the claim text.