Apparatus and method for coating substrates
AssigneeRTC Systems Ltd.
InventorDesmond Gibson
Life of this patent
Estimating the term…
Abstract
Apparatus (10) for treating a substrate, comprising: a vacuum chamber (12); a substrate carrier (14) adapted to carry a substrate (16) to be treated; a source material holder (22) for holding a source material (34) with which the substrate (16) is to be treated; and vaporising or sputtering means (20) for vaporising/sputtering the source material (34); wherein the source material holder (22) includes a positioning means (24) for relatively moving the source material (34) towards the substrate carrier (14).
Claims29
Apparatus for treating a substrate, comprising:
- a vacuum chamber;
- a substrate carrier adapted to carry a substrate to be treated;
- a source material holder for holding a source material with which the substrate is to be treated;
- and vaporizing or sputtering means for vaporizing or sputtering the source material;
- wherein the source material holder includes a positioning means for relatively moving the source material towards the substrate carrier, said source material holder comprising a receptacle adapted to contain the source material, the positioning means acting on the receptacle to move it in the desired direction, and further wherein the positioning means comprises rotation means for rotating the receptacle and linear movement means for moving the receptacle linearly.
A source material holder for holding a source material intended for vaporization or sputtering and subsequent treatment of a substrate carried on a substrate carrier, said source material holder comprising a receptacle adapted to contain the source material, means to rotate the receptacle, and means to move the receptacle linearly, whereby the source material holder can be rotated and moved linearly simultaneously.
Apparatus for treating a substrate, comprising:
- a vacuum chamber;
- a substrate carrier adapted to carry a substrate to be treated;
- a source material holder for holding a source material which is to treat the substrate, and further wherein said source material holder comprises a receptacle adapted to contain the source material;
- vaporizing or sputtering means for vaporizing or sputtering the source material;
- wherein the vaporizing or sputtering means includes means to generate a vaporizing or sputtering beam for vaporizing or sputtering the source material at a surface thereof, and includes means to vary the frequency of the vaporizing or sputtering beam;
- and a positioning means acting on the receptacle to move it in a desired direction, wherein the positioning means comprises rotation means for rotating the receptacle and linear movement means for moving the receptacle linearly.
Apparatus for treating a substrate, comprising:
- a vacuum chamber;
- a substrate carrier adapted to carry a substrate to be treated;
- a source material holder for holding a source material which is to treat the substrate, and further wherein said source material holder comprises a receptacle adapted to contain the source material;
- vaporizing or sputtering means for vaporizing or sputtering the source material;
- wherein the vaporizing or sputtering means includes means to generate a vaporizing or sputtering beam for vaporizing or sputtering the source material at a surface thereof, and includes means to vary the thickness of the vaporizing or sputtering beam;
- and a positioning means acting on the receptacle to move it in a desired direction, wherein the positioning means comprises rotation means for rotating the receptacle and linear movement means for moving the receptacle linearly.
Apparatus for treating a substrate, comprising:
- a vacuum chamber;
- a substrate carrier adapted to carry a substrate to be treated;
- a source material holder for holding a source material which is to treat the substrate, and further wherein said source material holder comprises a receptacle adapted to contain the source material;
- vaporizing or sputtering means for vaporizing or sputtering the source material;
- wherein the vaporizing or sputtering means includes means to generate a vaporizing or sputtering beam for vaporizing or sputtering the source material at a surface thereof, and includes means to dither the vaporizing or sputtering beam over the surface of the source material;
- and a positioning means acting on the receptacle to move it in a desired direction, wherein the positioning means comprises rotation means for rotating the receptacle and linear movement means for moving the receptacle linearly.
Dependencies are inferred from the claim text.