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US 6,616,801 B1Granted
Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
AssigneeLam Research Corporation
InventorJohn M. Boyd
Life of this patent
Estimating the term…
Abstract
Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path.
Claims13
An apparatus for polishing a semiconductor wafer comprising:
- a conveyor adapted to transport a backing along a process path;
- a patterning device, the patterning device designed to apply a pattern on to the backing to guide deposition of an abrasive on to the backing;
- a first container positioned along the process path and adjacent to the patterning device, the first container designed to deposit an abrasive/binding agent mixture onto the backing;
- an affixation station positioned along the process path and downstream from the first container, the affixation station configured to expose a backing upon which abrasive/binding agent mixture has been deposited to conditions which cause the abrasive/binding agent mixture to become affixed to the backing thereby creating a fixed-abrasive substrate;
- and
- a wafer polishing station positioned along the process path and downstream from the affixation station, the wafer polishing station comprising a wafer carrier assembly for supporting a semiconductor wafer and for transporting the wafer toward the substrate such that the wafer contacts the surface of the fixed abrasive substrate, and a substrate support disposed beneath the fixed-abrasive substrate and opposite the wafer carrier.
3 more elements
An apparatus for polishing a semiconductor wafer comprising:
- a conveyor adapted to transport a backing along a process path;
- an electrostatic patterning device, the electrostatic patterning device designed to apply an electrostatic field of predetermined pattern and density onto the backing;
- a first container positioned along the process path and adjacent to the electrostatic patterning device, the first container designed to deposit an abrasive/binding agent mixture onto the backing;
- a polymerization station positioned along the process path and downstream from the first container, the polymerization station configured to expose a backing upon which abrasive/binding agent mixture has been deposited to conditions which cause the abrasive/binding agent mixture to become affixed to the backing and creating a fixed-abrasive substrate;
- and
- a wafer polishing station positioned along the process path and downstream from the polymerization station, the wafer polishing station comprising a wafer carrier assembly for supporting a semiconductor wafer and for transporting the wafer toward the substrate such that the wafer contacts the surface of the fixed abrasive substrate, and a substrate support disposed beneath the fixed-abrasive substrate and opposite the wafer carrier.
3 more elements
Dependencies are inferred from the claim text.