Redetachable, self-adhesive device
AssigneeTesa SE
InventorsBernd Lühmann, Andreas Junghans, Thomas Raadts
Life of this patent
Estimating the term…
Abstract
Redetachable, self-adhesive device having a plate, the sides and/or front side of which have fastening means, if appropriate, and the rear side of which has a strip of an adhesive film which is adhesive on both sides and is adhesively attached in such a way that one end of the adhesive film protrudes beyond the plate as a grip, the adhesive film being of such a kind that the adhesive bond achieved with it can be released again by pulling in the direction of the bonding plane, stretching the strip, characterized in that the rear side of the plate (1) has laterally alongside the adhesively attached adhesive film (5) spacers (3A, 3B), the height of which is less than the thickness of the adhesive film (5).
Claims32
A method of forming a temporary bond between a substrate and a device, which bond can be released easily and without residue, said method comprising the following steps:
- a) providing a device comprising:
- i) a plate having a front, a rear and four sides;
- and
- ii) a double-sided adhesive strip of film adhered to the rear of said plate through an adhesive bond in such a way that one end of said adhesive film strip protrudes from said plate as a grip;
- wherein
- the adhesive bond between said adhesive film strip and said plate can be released by pulling and stretching the adhesive film strip;
- and
- spacers are arranged on both sides on the rear of said plate alongside the adhesively attached film strip, said spacers extending less than the entire length of said plate, and said spacers projecting from the rear of the plate to a height that is less than the thickness of said adhesive film strip;
- b) adhering said device to said substrate by means of an adhesive bond formed between said substrate and said adhesive film strip, and
- c) releasing said device from said substrate by pressing said plate and said adhesive film strip against said substrate and pulling on the grip of said adhesive film strip to stretch said adhesive film strip to release said adhesive bond.
A method of forming a temporary bond between a substrate and a device, which bond can be released easily and without residue, said method comprising the following steps:
- a) providing a device comprising:
- i) a plate having a rear side, the rear side having at least one spacer extending less than the entire length of said plate and a planar surface;
- and
- ii) a strip of double-sided adhesive film adhesively attached to said planar surface, one end of the adhesive film protruding beyond the plate as a grip;
- and
- iii) at least one engaging device disposed on the plate for engaging an adaptor;
- wherein
- the spacer height is less than the thickness of the adhesive film and an adhesive bond between said adhesive film and said plate can be released by pulling on the adhesive film in the direction of the plane of said bond;
- b) adhering said device to said substrate by means of an adhesive bond formed between said substrate and said adhesive film strip, and
- c) releasing said device from said substrate by pressing said plate and said adhesive film strip against said substrate and pulling on the grip of said adhesive film strip to stretch said adhesive film strip to release said adhesive bond.
A method of forming a temporary bond between a substrate and a device, which bond can be released easily and without residue, said method comprising the following steps:
- a) providing a device comprising:
- i) a base member having a bottom surface and a mount for releasably engaging with an adaptor;
- and
- ii) a stretch-release double-sided adhesive strip disposable between the bottom surface and the support surface, said stretch-release double-sided adhesive strip comprising a grip tab;
- and
- iii) at least one spacer disposed on the bottom surface of the base member for engaging the support surface when the base member is urged in the direction of the support surface, the height of the spacer being less than the thickness of the adhesive film, and said spacer extending less than the entire length of said base member;
- b) adhering said device to said substrate by means of an adhesive bond formed between said substrate and said adhesive film strip, and
- c) releasing said device from said substrate by pressing said plate and said adhesive film strip against said substrate and pulling on the grip tab of said adhesive film strip to stretch said adhesive film strip to release said adhesive bond.
Dependencies are inferred from the claim text.