Substrate treatment method

A substrate treatment method comprising:

• maintaining a substrate having a work object on a surface of the substrate at a temperature higher than room temperature;
• and
• treating the work object on the surface of the substrate by supplying to the work object a wet ozone-containing gas wetted with a treatment solution, wherein the wet ozone-containing gas contains a concentration of vapor of the treatment solution larger than a saturation vapor level of the treatment solution at the temperature of the substrate, including controlling the temperature of the wet ozone-containing gas to be between 5° C. and 15° C. higher than the temperature of the substrate.

A substrate treatment method comprising:

• treating a work object on a surface of a substrate at a temperature by supplying to the work object a wet ozone-containing gas wetted with a treatment solution, wherein the wet ozone-containing gas contains a concentration of vapor of the treatment solution larger than a saturation vapor level of the treatment solution at the temperature of the substrate;
• and
• after treating the work object with the wet ozone-containing gas, cleaning the substrate with a cleaning solution containing at least one solvent chosen from the group consisting of pure water, acidic aqueous solutions, alkaline aqueous solutions, ketones, and alcohols.

A substrate treatment method further comprising:

• treating a work object on a surface of a substrate at a temperature by supplying to the work object a wet ozone-containing gas wetted with a treatment solution, wherein the wet ozone-containing gas contains a concentration of vapor of the treatment solution larger than a saturation vapor level of the treatment solution at the temperature of the substrate;
• and
• before treating the work object with the wet ozone-containing gas, irradiating the work object on the surface of the substrate with ultraviolet light having a wavelength of at least 300 nm.

A substrate treatment method comprising:

• treating a work object on a surface of a substrate at a temperature by supplying to the work object a wet ozone-containing gas wetted with a treatment solution, wherein the wet ozone-containing gas contains a concentration of vapor of the treatment solution larger than a saturation vapor level of the treatment solution at the temperature of the substrate;
• and
• while treating the work object on the surface of the substrate, reducing the amount of the treatment solution on the surface of the substrate, as treatment time elapses, by changing the temperature of one of the substrate and the wet ozone-containing gas.