High temperature ceramic heater assembly with RF capability

An assembly comprising:

• a ceramic upper layer;
• a perforated metal layer having a plurality of perforations, said perforated metal layer disposed below said ceramic upper layer;
• a plurality of electrodes coupled to an electrode base, said electrodes electrically coupling said perforated metal layer to said electrode base;
• and
• a ceramic bonding disk disposed between said perforated metal layer and said electrode base, said ceramic bonding disk having a plurality of holes through which said electrodes extend through said ceramic bonding disk to said perforated metal layer, wherein said ceramic upper layer is bonded to said ceramic bonding disk through at least one of said plurality of perforations in said perforated metal layer.