Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor

A semiconductor plasma processing apparatus for processing a semiconductor wafer, comprising:

• a sensor for monitoring a processing state of said semiconductor plasma processing apparatus;
• processing result input means for inputting externally measured values for processing results of a semiconductor wafer processed by said semiconductor processing apparatus in a pre-trial;
• a model equation generation unit which generates a model equation for predicting a processing result using sensed data acquired by said sensor as an explanatory variable, based on said sensed data and said externally measured values;
• a processing result prediction unit for predicting a processing result based on said model equation and said sensed data;
• and
• a process recipe control unit for comparing said predicted processing result with a pre-set value to control a processing condition of said semiconductor plasma processing apparatus such that a deviation between said predicted processing result and said pre-set value is corrected;
• wherein said model equation generation unit generates a model equation using robust regression.

A semiconductor plasma processing apparatus for processing a semiconductor wafer, comprising:

• a sensor for monitoring a processing state of said semiconductor plasma processing apparatus;
• processing result input means for inputting externally measured values for processing results of a semiconductor wafer processed by said semiconductor processing apparatus in a pre-trial;
• a model equation generation unit which generates a model equation for predicting a processing result using sensed data acquired by said sensor as an explanatory variable, based on said sensed data and said externally measured values;
• a processing result prediction unit for predicting a processing result based on said model equation and said sensed data;
• and
• a process recipe control unit for comparing said predicted processing result with a pre-set value to control a processing condition of said semiconductor plasma processing apparatus such that a deviation between said predicted processing result and said pre-set value is corrected;
• wherein said model equation generation unit generates a model equation using principal component robust regression.

A semiconductor plasma processing apparatus for processing a semiconductor wafer, comprising:

• a sensor for monitoring a processing state of said semiconductor plasma processing apparatus;
• processing result input means for inputting externally measured values for processing results of a semiconductor wafer processed by said semiconductor processing apparatus in a pre-trial;
• a model equation generation unit which generates a model equation for predicting a processing result using sensed data acquired by said sensor as an explanatory variable, based on said sensed data and said externally measured values;
• a processing result prediction unit for predicting a processing result based on said model equation and said sensed data;
• and
• a display unit for displaying said predicted value or a deviation of said predicted value from a pre-set value.

A semiconductor processing apparatus for processing a semiconductor wafer, comprising:

• a sensor for monitoring a processing state of said semiconductor processing apparatus;
• processing result input means for inputting measured values for processing results of a semiconductor wafer processed by said semiconductor processing apparatus;
• a model equation generation unit relying on sensed data acquired by said sensor and said measured values to generate a model equation for predicting a processing result using said sensed data as an explanatory variable;
• a processing result prediction unit for predicting a processing result based on said model equation and said sensed data;
• a process recipe control unit for comparing said predicted processing result with a previously set value to control a processing condition of said semiconductor processing apparatus such that a deviation between said predicted processing result and said previously set value is corrected;
• a principal component extraction unit for extracting a principal component based on said sensed data acquired by said sensor;
• and
• a fault detection unit for detecting a fault in processing based on variations in the principal component extracted by said extraction unit;
• wherein said semiconductor plasma processing apparatus stops the processing when said fault detection unit detects a fault if said model equation generation unit has not generated a model equation;
• and
• wherein said model equation generation unit generates a model equation using a PLS method (Partial Least Square method).

A semiconductor plasma processing apparatus for processing a semiconductor wafer, comprising:

• a sensor for monitoring a processing state of said semiconductor plasma processing apparatus;
• a model equation holding unit which receives and holds a model equation for predicting a processing result using sensed data acquired by said sensor as an explanatory variable, which is generated based on said sensed data and measured values, said measured values being externally measured values for processing results of a semiconductor wafer processed by said semiconductor plasma processing apparatus in a pre-trial;
• a processing result prediction unit coupled to said model equation holding unit and said sensor, for predicting a processing result based on said model equation and said sensed data;
• and
• a process recipe control unit for comparing said predicted processing result with a pre-set value to control a processing condition of said semiconductor plasma processing apparatus such that a deviation between said predicted processing result and said pre-set value is corrected.