Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure

A method for preparing a semiconductor wafer, the method comprising:

• disposing a semiconductor wafer in a vertical orientation in an enclosure;
• performing a cleaning operation on the wafer in the enclosure using a pair of cylindrical brushes;
• and
• performing a polishing operation on the wafer in the enclosure using a pair of cylindrical polishing pads.

A method for polishing a semiconductor wafer, the method comprising:

• disposing a semiconductor wafer in a vertical orientation in an enclosure;
• rotating the wafer;
• performing a first polishing operation on the rotating wafer in the enclosure using a first pair of cylindrical polishing pads;
• and
• performing a second polishing operation on the rotating wafer in the enclosure using a second pair of cylindrical polishing pads.

A method for preparing a semiconductor wafer, the method comprising:

• disposing a semiconductor wafer in a vertical orientation in an enclosure;
• performing a first wafer preparation operation on the wafer in the enclosure using a first pair of wafer preparation members;
• and
• performing a second wafer preparation operation on the wafer in the enclosure using a second pair of wafer preparation members, wherein the first and second pairs of wafer preparation members are disposed on opposing wafer preparation assemblies, with each of the wafer preparation assemblies having one of the first pair of wafer preparation members and one of the second pair of wafer preparation members disposed thereon.