Gantry mounted ultrasonic wire bonder with orbital bonding tool head
AssigneeWest Bond, Inc.
InventorCharles F. Miller
Life of this patent
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AssigneeWest Bond, Inc.
InventorCharles F. Miller
Estimating the term…
An automatic ultrasonic wire bonding machine for bonding interconnecting wires to electrically conductive sites on a workpiece includes a gantry which supports a generally downwardly cascaded series of support platforms linearly translatable with respect to the gantry and to one another in response to translation drive signals provided from a remote source to a separate translation motor for each platform. A head support assembly mounted to the last translatable platform in the series rotatably supports via a hollow elongated spindle an orbital bonding tool head rotatable with respect to the head support assembly in response to a rotational drive signals provided to a head rotation motor from a remote source. The orbital bonding tool head in turn supports via a novel parallelogram linkage an ultrasonic transducer having fitted therein a downwardly protruding ultrasonic bonding tool, the parallelogram linkage enabling the tool tip to be displaced only vertically in response to reaction forces exerted on the tip in translating the tip downwardly into contact with a workpiece.
A machine for making ultrasonic wire bonds comprising;
A machine for making ultrasonic wire bonds comprising;
An automatic ultrasonic wire bonding machine comprising;
A machine for making ultrasonic wire bonds comprising;
A machine for making ultrasonic wire bonds comprising;
An automatic ultrasonic wire bonding machine comprising;
Dependencies are inferred from the claim text.