High performance liquid-cooled heat sink with twisted tape inserts for electronics cooling

A liquid-cooled heat sink for use with a cooling fluid and in combination with a heat exchanger to cool electronic or electrical devices attached to said heat sink, said heat sink comprising:

• a metal block having a plurality of circular passageways extending from one end to another end of said metal block, said circular passageways being defined by cylindrical walls;
• at least one tape insert having edges and being mounted within at least one of said circular passageways, wherein said tape insert longitudinally bisects said circular passageway and wherein said edges of said tape insert abut said cylindrical wall;
• and
• said tape insert being twisted about a longitudinal axis of said passageway for further increasing the amount of heat transferred and defining tape faces;
• said tape faces having a plurality of louvers spaced closely from one another on each of said tape faces;
• and
• said plurality of louvers extending across said tape faces of said tape insert and being aligned normal to a flow of the cooling fluid such that said tape faces are substantially free of any surfaces parallel to the flow of the cooling fluid for continuously agitating the cooling fluid and increasing the turbulence of the cooling fluid which increases heat transfer from said heat sink to said cooling fluid.