Wafer cleaning apparatus
AssigneeEbara Corporation
InventorsAkihisa Hongo, Shinya Morisawa
Life of this patent
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Abstract
An object of the present invention is to provide a wafer cleaning apparatus for cleaning wafer that have received various processing such as copper plating and chemical mechanical polishing. An apparatus for cleaning front and back surfaces of a wafer with solution while rotating the wafer that hag been subjected to a fabrication process is disclosed. The apparatus comprises cleaning nozzles for spraying a cleaning solution, respectively, onto a front surface of the wafer that has been processed and onto a back surface thereof and also comprises an etching nozzle for spraying an etching solution onto a vicinity of the outer periphery of the wafer.
Claims25
An apparatus for plating a metal film onto a surface of a seed layer of a substrate, for cleaning the substrate and the metal film, and for etching the metal film, comprising:
- a plating section having a plating device for plating a metal film onto a surface of a seed layer of a substrate;
- a cleaning section having a cleaning device, said cleaning device including
- (i) a rotation mechanism for holding and rotating the substrate with the metal film plated thereon facing upwardly, and
- (ii) at least one first nozzle for ejecting an etching solution only onto a peripheral portion of the metal film for removing the peripheral portion of the metal film and a peripheral portion of the seed layer;
- and
- a robotic mechanism for transporting the substrate with the metal film plated thereon from said plating section to said cleaning section.
An apparatus for plating a metal film onto a surface of a seed layer of a substrate, for cleaning the substrate and the metal film, and for etching the metal film, comprising:
- a plating device for plating a metal film onto a surface of a seed layer of a substrate;
- a cleaning device including
- (i) a rotation mechanism for holding and rotating the substrate with the metal film plated thereon facing upwardly, and
- (ii) at least one first solution supplier for ejecting an etching solution only onto a peripheral portion of the metal film for removing the peripheral portion of the metal film and a peripheral portion of the seed layer;
- and
- a transport mechanism for transporting the substrate with the metal film plated thereon from said plating device to said cleaning device.
Dependencies are inferred from the claim text.