Rotary cutting saw having abrasive segments in which wear-resistant grains are regularly arranged
AssigneesNoritake Co., Limited, Noritake Super Abrasive Co., Ltd.
InventorSeiya Ogata
Life of this patent
Estimating the term…
Loading patent…
AssigneesNoritake Co., Limited, Noritake Super Abrasive Co., Ltd.
InventorSeiya Ogata
Estimating the term…
A rotary cutting saw including (a) a base disk and (b) a plurality of abrasive segments fixed to an outer circumferential surface of the base disk and are spaced apart from each other in a circumferential direction of the base disk. The base disk has a plurality of slits which are formed in the outer circumferential surface of the base disk and are located between adjacent ones of the abrasive segments in the circumferential direction. Each slit extends inwardly in a radial direction of the base disk from the outer circumferential surface of the base disk. Each of the abrasive segments includes abrasive grains and wear-resistant grains each of which has a size substantially equal to a size of each of the abrasive grains. The wear-resistant grains are exposed on a side surface of each abrasive segment and are regularly arranged on the side surface.
A rotary cutting saw, comprising:
Dependencies are inferred from the claim text.