A profiling die set for the superplastic forming of metal parts having primary outer show surfaces and secondary outer surfaces that will be visually hidden starting with blanks of metallic and plastically formable sheet material, said die set comprising first tooling with peripheral walls providing a continuous pneumatic seal and defining a pressure chamber, a profiling die having a first profiling surface area for profiling said primary outer show surfaces and a second profiling surface area that profiles said secondary outer surfaces of the part, said profiling die cooperating with the pressure chamber to define a support and forming station for each of said blanks provided thereto, a series of gas conducting passages extending through said profiling die and terminating only in said second profiling surface area that profiles the secondary outer surfaces of the formed metal part, said gas supply and controls further incorporating a manifold operatively coupled to the profiling die for the even distribution of pressurized gas to each of said passages and thereby supplying streams of pressurized gas providing pneumatic lifting forces operatively directed to said part containing said second outer surfaces to lift the formed part from the profiling die without distortion or damage to said first outer surfaces of said part and further effecting the cooling and contraction of the formed part relative to the profiling die to augment the removal of the formed part therefrom.