Arrangement for using a plate shaped element with through-openings for cooling a component

An arrangement for cooling a component, comprising:

• at least one cooling duct configured between a wall to be cooled and a plate-shaped element for flow of a cooling medium in a flow direction along the wall to be cooled, the plate-shaped element being at a height from the wall and having a number of through-openings for impingement of flow of the cooling medium onto the wall, the height between the plate-shaped element and the wall increasing in the flow direction of the cooling medium flowing through the cooling duct, diameters of adjacent through-openings in the plate-shaped element increase with increasing height between the plate-shaped element and the wall, wherein a ratio of a distance between adjacent through-openings to the diameter of one of the adjacent through-openings is constant over the length of the cooling duct.

An arrangement for cooling a component, comprising:

• at least one cooling duct configured between a wall to be cooled and a plate-shaped element for flow of a cooling medium in a flow direction along the wall to be cooled, the plate-shaped element being at a height from the wall and having a number of through-openings for impingement of flow of the cooling medium onto the wall, the height between the plate-shaped element and the wall increasing in the flow direction of the cooling medium flowing through the cooling duct, diameters of adjacent through-openings in the plate-shaped element increase with increasing height between the plate-shaped element and the wall, wherein a ratio of the height between the plate-shaped element and the wall at one of the through-openings to the diameter of the respective through-opening is constant over the length of the cooling duct.