Opto-electronic substrates with electrical and optical interconnections and methods for making
AssigneeFujitsu Limited
InventorsTetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William Chou, Solomon I. Beilin, Wen-chou Vincent Wang, James J. Roman, Thomas J. Massingill
Life of this patent
Estimating the term…
Abstract
Disclosed is device and/or material integration into thin opto-electronic layers, which increase room for chip-mounting, and reduce the total system cost by eliminating the difficulty of optical alignment between opto-electronic devices and optical waveguides. Opto-electronic devices are integrated with optical waveguides in ultra thin polymer layers on the order of 1 μm to 250 μm in thickness.
Claims45
A substrate having optical and electrical interconnections, comprising:
- a base layer having a top surface and a bottom surface;
- an optical-electrical device having a top surface, a bottom surface disposed over the top surface of said base layer, and at least one side surface disposed between the device's top and bottom surfaces, said optical-electrical device comprising a first electrical terminal and a second electrical terminal, with at least the first electrical terminal being disposed on the top surface of the optical-electrical device;
- an optical waveguide core formed on the top surface of said base layer having an end which terminates adjacent to said at least one side surface of said optical-electrical device;
- and
- an upper cladding layer formed over at least a portion of the top surface of the optical-electrical device and over at least a portion of the optical waveguide core, with a portion of the upper cladding layer overlying a portion of the first electrical terminal.
A substrate having optical and electrical interconnections, comprising:
- a base layer having a top surface and a bottom surface;
- an optical-electrical device comprising a semiconductor material and having a top surface, a bottom surface disposed over the top surface of said base layer, at least one side surface disposed between the device's top and bottom surfaces, a first electrical terminal, and a second electrical terminal, at least one of said electrical terminals being disposed on the top surface, said optical-electrical device having a thickness between its top and bottom surfaces, the value of thickness being between 1 μm and 20 μm;
- and
- an optical waveguide core formed on the top surface of said base layer and having an end which terminates adjacent to said at least one side surface of said optical-electrical device and which attaches to at least a portion of said at least one side surface, said optical waveguide core comprising a polymeric material and having a thickness between 3 μm and 20 μm.
A substrate having optical and electrical interconnections, comprising:
- a base cladding layer having a top surface and a bottom surface;
- an optical-electrical device having a top surface, a bottom surface disposed over the top surface of said base layer, at least one side surface disposed between the device's top and bottom surfaces, a first electrical terminal, and a second electrical terminal, at least one of said electrical terminals being disposed on the top surface;
- and
- an optical waveguide core formed on the top surface of said base layer having an end which terminates adjacent to said at least one side surface of said optical-electrical device, said optical waveguide core comprising a polymeric material and having a thickness between 3 μm and 20 μm;
- and
- an upper cladding layer disposed over said optical waveguide core and said base layer, the upper cladding layer having an unpolished bottom surface disposed over said optical waveguide core and said base layer, and a polished top surface opposite to the bottom surface.
Dependencies are inferred from the claim text.