Semiconductor integrated circuit device
AssigneeHitachi, Ltd.
InventorsKoichiro Ishibashi, Shoji Shukuri, Kazumasa Yanagisawa, Junichi Nishimoto, Masanao Yamaoka, Masakazu Aoki
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AssigneeHitachi, Ltd.
InventorsKoichiro Ishibashi, Shoji Shukuri, Kazumasa Yanagisawa, Junichi Nishimoto, Masanao Yamaoka, Masakazu Aoki
Estimating the term…
To reduce cost of defect redundancy and trimming in a semiconductor integrated circuit having multiple layer wirings and copper wirings, address for salvaging defect of a memory cell array in a semiconductor is stored by using a nonvolatile memory element constituting a floating electrode by a first layer of polysilicon, or the nonvolatile memory element is programmed in testing the semiconductor integrated circuit, thereby, a special process is not needed in forming the nonvolatile memory element, that is, the nonvolatile memory element can be formed in a process of forming CMOS device and apparatus of laser beam for programming is not needed since the programming is carried out in testing, time necessary for programming can be shortened and therefore, testing cost can be reduced.
A semiconductor integrated circuit device comprising:
A semiconductor integrated circuit device comprising:
The semiconductor integrated circuit device comprising:
A semiconductor integrated circuit device comprising:
Dependencies are inferred from the claim text.