Connection material
AssigneeSony Chemicals Corp.
InventorsMotohide Takeichi, Junji Shinozaki
Life of this patent
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Abstract
The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.
Claims10
A connection material for connecting a flexible circuit board to a bare IC chip, comprising an insulating adhesive, and a flaky or fibrous insulating filler dispersed therein wherein the aspect ratio of the flaky or fibrous insulating filler is at least 20.
Dependencies are inferred from the claim text.