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US 6,611,063 B1Granted
Resin-encapsulated semiconductor device
AssigneeNEC Electronics Corporation
InventorsMichihiko Ichinose, Tomoko Takizawa, Hirokazu Honda, Keiichirou Kata
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Abstract
A method for forming a mold-encapsulated semiconductor device includes the steps of mounting a semiconductor chip on a metallic plate having a metallic interconnect pattern thereon, encapsulating the semiconductor chip on the metallic interconnect pattern, removing the bottom of the metallic plate by etching to expose the metallic interconnect pattern, and forming external terminals on the bottom of the metallic interconnect pattern. The method reduces the thickness as well as the planar dimensions of the semiconductor device.
Claims1
A semiconductor device comprising:
- a semiconductor chip having a plurality of chip electrodes thereon;
- a metallic interconnect pattern having a top surface connected to said plural chip electrodes and supporting said semiconductor chip, at least a top portion of said metallic interconnect pattern being formed by an electrolytic plating technique;
- an insulating film covering a bottom surface of said metallic interconnect pattern and having through-holes therein;
- a plurality of external terminals formed on said bottom surface of said interconnect pattern in said through-holes;
- a mold resin encapsulating said semiconductor chip on said top surface of said metallic interconnect pattern and said insulating film;
- another semiconductor chip mounted on said bottom surface of said metallic interconnect pattern;
- and
- another mold resin encapsulating said another semiconductor chip on said bottom surface of said metallic interconnect pattern.
5 more elements
Dependencies are inferred from the claim text.