Chip edge interconnect apparatus and method
AssigneeInternational Business Machines Corporation
InventorsThomas G. Ference, Wayne J. Howell, William R. Tonti, Richard Q. Williams
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Abstract
The present invention provides a method of forming a low profile chip interconnection, and the interconnection so formed. A recessed contact area is formed at an edge of the wafer. A conductive material is deposited within the adjacent contact areas of each recess, thereby electrically connecting the two chips. The recess may have substantially perpendicular sides, or sloped sides.
Claims16
A semiconductor chip connection structure, comprising:
- an opening formed by a recess within an edge of a first chip and an edge of a second chip, wherein each recess includes a conductive area and sloped sides, and wherein a dicing channel separates the first and second chips and a midpoint of the opening is offset from a midpoint of the dicing channel;
- and
- a connection between the conductive areas of the first and second chips.
A device including at least two chips connected via an edge connection, wherein the edge connection further includes an opening formed by a recess within the edge of the at least two chips, wherein each recess includes a conductive area and sloped sides, and wherein a dicing channel separates the at least two chips and a midpoint of the opening is offset from a midpoint of the dicing channel.
Dependencies are inferred from the claim text.