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US 6,611,049 B2Granted
Semiconductor device with chamfered substrate and method of making the same
AssigneeRohm Co., Ltd.
InventorMasahiko Kobayakawa
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes an insulating substrate, a cutout formed in side surfaces of the substrate, a conductive pad formed on the obverse surface of the substrate, an electrode formed on the reverse surface of the substrate, a semiconductor chip mounted on the substrate, and a connector which connects the pad to the electrode. The connector is arranged in the cutout.
Claims10
A semiconductor device comprising:
- an insulating substrate having an obverse surface, a reverse surface and side surfaces extending between the obverse and the reverse surfaces;
- a cutout formed in at least one of the side surfaces of the substrate, the cutout being laterally open;
- a conductive pad formed on the obverse surface of the substrate;
- an electrode formed on the reverse surface of the substrate;
- a semiconductor chip mounted on the substrate in electrical conduction with the pad;
- a connector which connects the pad to the electrode, the connector being arranged in the cutout;
- and
- a resin package enclosing the semiconductor chip,
- wherein the conductive pad has an overhanging portion projecting above the cutout, the overhanging portion keeping the cutout laterally open by preventing the package from contacting the connector.
6 more elements
A semiconductor device comprising:
- an insulating substrate having an obverse surface, a reverse surface and side surfaces extending between the obverse and the reverse surfaces;
- a cutout formed in at least one of the side surfaces of the substrate;
- a conductive pad formed on the obverse surface of the substrate;
- an electrode formed on the reverse surface of the substrate;
- a semiconductor chip mounted on the substrate in electrical conduction with the pad;
- a connector which connects the pad to the electrode, the connector being arranged in the cutout;
- and
- a resin package enclosing the semiconductor chip,
- wherein the package comprises a leg portion which reaches the cutout, thereby concealing the connector.
6 more elements
A semiconductor device comprising:
- an insulating substrate having an obverse surface, a reverse surface and side surfaces extending between the obverse and the reverse surfaces;
- a cutout formed in at least one of the side surfaces of the substrate;
- a conductive pad formed on the obverse surface of the substrate;
- an electrode formed on the reverse surface of the substrate;
- a semiconductor chip mounted on the substrate in electrical conduction with the pad;
- a connector which connects the pad to the electrode, the connector being arranged in the cutout;
- a filler disposed at the cutout;
- and
- a resin package enclosing the semiconductor chip,
- wherein the filler is held in direct contact with the resin package and extends from the resin package into the cutout.
7 more elements
Dependencies are inferred from the claim text.