Semiconductor package with singulation crease

An integrated circuit chip package comprising:

• a leadframe including a plurality of contacts;
• an integrated circuit die electrically connected to the leadframe;
• and
• a package body partially encapsulating the leadframe and the integrated circuit die, the package body including:
• a central portion;
• a peripheral portion circumventing the central portion and defining opposed top and bottom surfaces, the contacts being partially exposed within the bottom surface of the peripheral portion;
• and
• means disposed within each of the top and bottom surfaces of the peripheral portion and the exposed surfaces of the contacts for forming a stress concentration line in the package body.

An integrated circuit chip package comprising:

• a leadframe having a frame thickness;
• an integrated circuit die electrically connected to the leadframe;
• and
• a package body partially encapsulating the leadframe and the integrated circuit die, the package body including:
• a central portion;
• a peripheral portion circumventing the central portion and defining opposed top and bottom surfaces;
• and
• top and bottom singulation creases disposed within respective ones of the top and bottom surfaces of the peripheral portion of the package body in opposed relation to each other, the peripheral portion having a web thickness between the singulation creases which is approximately one-half the frame thickness.

An integrated circuit chip package comprising:

• a leadframe;
• an integrated circuit die electrically connected to the leadframe;
• and
• a package body partially encapsulating the leadframe and the integrated circuit die, the package body including:
• a central portion;
• a peripheral portion circumventing the central portion and defining opposed top and bottom surfaces;
• and
• top and bottom singulation creases disposed within respective ones of the top and bottom surfaces of the peripheral portion of the package body in opposed relation to each other, the peripheral portion having a body thickness and a web thickness between the singulation creases which is approximately one-half the body thickness.

An integrated circuit chip package comprising:

• a leadframe;
• an integrated circuit die electrically connected to the leadframe;
• and
• a package body partially encapsulating the leadframe and the integrated circuit die, the package body including:
• a central portion;
• a peripheral portion circumventing the central portion and defining opposed top and bottom surfaces;
• and
• a singulation crease disposed in at least one of the, top and bottom surfaces of the peripheral portion of the package body and circumventing the central portion thereof.

An integrated circuit chip package comprising:

• a leadframe;
• an integrated circuit die electrically connected to the leadframe;
• and
• a package body partially encapsulating the integrated circuit die, the package body including:
• a central portion;
• a peripheral portion circumventing the central portion and defining opposed top and bottom surfaces;
• and
• means disposed within at least one of the top and bottom surfaces of the peripheral portion for forming a stress concentration line in the package body which circumvents the central portion thereof.