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US 6,610,991 B1Granted
Electronics assembly apparatus with stereo vision linescan sensor
AssigneeCyberOptics Corporation
InventorSteven K. Case
Life of this patent
Estimating the term…
Abstract
An electronics assembly apparatus, and its imaging system are disclosed. The imaging system, which can include a linescan sensor, measures the height of an object on a component as well as the coplanarity of object features by viewing the object features from a plurality of view angles.
Claims56
An optical system for sensing a height of a feature on an object, the system comprising:
- a lens system for viewing the feature;
- a detector;
- a first optical path having a first aperture viewing the feature from a first angle, so as to form a first partial image of the feature on a first section of the detector, the first partial image representative of a portion of the feature;
- a second optical path having a second aperture aligned to an optical element so as to view the feature from a second angle and to re-direct light passing through the second aperture and the optical element onto a second section of the detector, thereby forming a second partial image representative of a portion of the feature thereon, the first angle different from the second angle;
- a motion control system for providing a relative motion between the detector and the feature;
- control electronics for collecting image portions from the detector;
- and
- video processing circuitry for assembling the image portions from the first and the second optical paths into a first and a second assembled image, respectively, the circuitry providing the height of the feature as a function of the first and the second assembled images.
5 more elements
A pick and place machine adapted to place a component, the machine comprising:
- a host processor providing a desired location to place the component;
- a component placement head for releasably holding the component;
- a sensor head for slidably scanning the component, the sensor head comprising:
- a lens system for viewing the component, the system having an optical axis passing therethrough;
- a detector;
- two apertured optical elements positioned substantially in a plane perpendicular to the optical axis, each optical element positioned so as to view the component from a different angle and to re-direct a first and a second image of a portion of the component onto the detector, where the detector and the component are adapted to move relative to each other, so that after the relative movement is finished, a plurality of first images from the detector is representative of a first assembled image of the component and a plurality of second images from the detector is representative of a second assembled image of the component;
- and
- video processing circuitry for processing the first and the second assembled images to provide feature height information;
- and
- wherein the host processor instructs the component placement head based upon the feature height information.
7 more elements
A method of picking and placing a component with a pick and place machine, the method comprising:
- providing a desired location to place the component;
- releasably holding the component;
- slidably scanning the component, the scanning comprising:
- providing a lens system for viewing the component, the system having an optical axis passing therethrough;
- providing a detector;
- positioning two apertured optical elements substantially in a plane perpendicular to the optical axis, each optical element positioned so as to view the component from a different angle and to re-direct a first and a second image of a portion of the component onto the detector, where the detector and the component are adapted to move relative to each other, so that after the relative movement is finished, a plurality of first images from the detector is representative of a first assembled image of the component and a plurality of second images from the detector is representative of a second assembled image of the component;
- processing the first and the second assembled images to provide feature height information;
- and
- placing the component based upon the feature height information.
6 more elements
A sensor for sensing a height of a feature on an object, the sensor comprising:
- a lens system for viewing the feature;
- a detector;
- a first optical path having a first aperture viewing the feature from a first angle, so as to form a first partial image of the feature on a first section of the detector, the first partial image representative of a portion of the feature;
- a second optical path having a second aperture aligned to an optical element so as to view the feature from a second angle and to re-direct light passing through the second aperture and the optical element onto a second section of the detector, thereby forming a second partial image representative of a portion of the feature thereon, the first angle different from the second angle;
- control electronics for collecting image portions from the detector;
- and
- video processing circuitry for assembling the image portions from the first and the second optical paths into a first and a second assembled image, respectively, the circuitry providing at least the height of the feature as a function of the first and the second assembled images.
4 more elements
A wire bonder comprising:
- a host processor providing a desired location to attach a wire;
- a head for dispensing and coupling the wire;
- a sensor head for slidably scanning at least a portion of one of the wire, a die pad, and a lead frame, the sensor head comprising:
- a lens system for viewing the portion, the system having an optical axis passing therethrough;
- a detector;
- two apertured optical elements positioned substantially in a plane perpendicular to the optical axis, each optical element positioned so as to view the portion from a different angle and to re-direct a first and a second image of the portion onto the detector, wherein the detector and the portion are adapted to move relative to each other, so that after the relative movement is finished, a plurality of first images from the detector is representative of a first assembled image of the portion and a plurality of second images from the detector is representative of a second assembled image of the portion;
- and
- video processing circuitry for processing the first and the second assembled images to provide feature height information;
- and
- wherein the host processor instructs the wire bonder head based upon the feature height information.
7 more elements
A screen printer comprising:
- a host processor adapted to provide an output related to a characteristic of at least one of a stencil and a circuit board;
- a head adapted to dispense solder paste upon the circuit board;
- a sensor head for slidably scanning at least a portion of one of the circuit board and the stencil, the sensor head comprising:
- a lens system for viewing the portion, the system having an optical axis passing therethrough;
- a detector;
- two apertured optical elements positioned substantially in a plane perpendicular to the optical axis, each optical element positioned so as to view the portion from a different angle and to re-direct a first and a second image of the portion onto the detector, wherein the detector and the portion are adapted to move relative to each other, so that after the relative movement is finished, a plurality of first images from the detector is representative of a first assembled image of the portion and a plurality of second images from the detector is representative of a second assembled image of the portion;
- video processing circuitry for processing the first and the second assembled images to provide feature height information;
- and
- wherein the host processor provides the output based at least in part upon the feature height information.
6 more elements
Dependencies are inferred from the claim text.