Semiconductor module and method of making the device
AssigneeHitachi, Ltd.
InventorsYoshihide Yamaguchi, Takao Terabayashi, Hiroyuki Tenmei, Hiroshi Hozoji, Naoya Kanda
Life of this patent
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Abstract
A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.
Claims14
A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices, wherein
- the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wirings and an insulation layer.
A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices, wherein,
- the wiring substrate comprises a glass substrate having holes for establishing electrical connection between both surfaces and plural wiring layers each formed on the surface of the glass substrate and having wirings and an insulation layer, the diameter of the hole being enlarged from one open end to the other open end,
- wherein wirings are formed to the inner wall surface of the hole and an insulation material is filled inside the hole.
A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices, wherein,
- the wiring substrate comprises a glass substrate having holes for establishing electrical connection between both surfaces and plural wiring layers each formed on the surface of the glass substrate and having wirings and an insulation layer, the diameter of the hole being enlarged from one open end to the other open end,
- wherein the thickness of the glass substrate is 30 times to 50 times the thickness of the insulation layer.
A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices, wherein,
- the wiring substrate comprises a glass substrate having holes for establishing electrical connection between both surfaces and plural wiring layers each formed on the surface of the glass substrate and having wirings and an insulation layer, the diameter of the hole being enlarged from one open end to the other open end,
- wherein the semiconductor devices and the wiring substrate are connected by means of a lead free solder.
A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices, wherein,
- the wiring substrate comprises a glass substrate having holes for establishing electrical connection between both surfaces and plural wiring layers each formed on the surface of the glass substrate and having wirings and an insulation layer, the diameter of the hole being enlarged from one open end to the other open end, wherein the glass substrate comprises low alkali glass.
A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices, wherein,
- the wiring substrate comprises a glass substrate having holes for establishing electrical connection between both surfaces and plural wiring layers each formed on the surface of the glass substrate and having wirings and an insulation layer, the diameter of the hole being enlarged from one open end to the other open end,
- wherein the alkali ion content of the glass substrate is between the alkali ion content of soda lime and the alkali ion content of non-alkali glass.
Dependencies are inferred from the claim text.