Device and method for nondestructive inspection on semiconductor device

A semiconductor device for nondestructive inspection, comprising:

• a first conductor being formed on a substrate;
• a second conductor being formed on the substrate in proximity to the first conductor;
• a thermoelectromotive force generator being formed, on the substrate;
• a first wire for connecting a first end of the thermoelectromotive force generator to the first conductor;
• a second wire for connecting a second end of the thermoelectromotive force generator to the second conductor;
• and
• wherein the first and second conductors correspond to wires respectively.

A semiconductor device for nondestructive inspection, comprising:

• a first conductor being formed on a substrate;
• a second conductor being formed on the substrate in proximity to the first conductor;
• a thermoelectromotive force generator being formed, on the substrate;
• a first wire for connecting a first end of the thermoelectromotive force generator to the first conductor;
• a second wire for connecting a second end of the thermoelectromotive force generator to the second conductor;
• and
• wherein the first and second conductors are elongated on the substrate by way of an insulating layer, while the first and second wires and the thermoelectromotive force generator are formed on the insulating layer above the first and second conductors.

A semiconductor device for nondestructive inspection, comprising:

• a first conductor being formed on a substrate;
• a second conductor being formed on the substrate in proximity to the first conductor;
• a thermoelectromotive force generator being formed, on the substrate;
• a first wire for connecting a first end of the thermoelectromotive force generator to the first conductor;
• a second wire for connecting a second end of the thermoelectromotive force generator to the second conductor;
• and
• wherein at least one the first and second conductors is elongated substantially in parallel with at least one of the first and second wires and is different from at least one of the first and second wires in width.

A semiconductor device for nondestructive inspection, comprising:

• a first conductor being formed on a substrate;
• a second conductor bring formed on the substrate in proximity to the first conductor;
• a thermoectromotive force generator being formed, on the substrate;
• a first wire for connecting a first end of the thermoelectromotive force generator to the first conductor;
• a second wire for connecting a second end of the thermoelectromotive force generator to the second conductor;
• wherein the first and second conductors are elongated in a first direction and arranged in parallel with each other, while the first and second wires and the thermoelectromotive force generator are arranged along a second direction that crosses the first direction.

A semiconductor device for nondestructive inspection, comprising:

• a first conductor being formed on a substrate;
• a second conductor being formed on the substrate in proximity to the first conductor;
• a thermoelectromotive force generator being formed, on the substrate;
• a first wire for connecting a first end of the thermoelectromotive force generator to the first conductor;
• a second wire for connecting a second end of the thermoelectromotive force generator to the second conductor;
• and
• wherein first and second conductors are respectively connected to the first and second wires by way of inspection vias.

A semiconductor device for nondestructive inspection, comprising:

• a first conductor being formed on a substrate;
• a second conductor being formed on the substrate in proximity to the first conductor;
• a thermoelectromotive force generator being formed, on the substrate;
• a first wire for connecting a first end of the thermoelectromotive force generator to the first conductor;
• a second wire for connecting a second end of the thermoelectromotive force generator to the second conductor;
• and
• wherein at least one of the first and second wires is composed of a plurality of wires, which are formed in different levels respectively.

A semiconductor device for nondestructive inspection, comprising:

• a first conductor being formed on a substrate;
• a second conductor being formed on the substrate in proximity to the first conductor;
• a thermoelectromotive force generator being formed, on the substrate;
• a first wire for connecting a first end of the thermoelectromotive force generator to the first conductor;
• a second wire for connecting a second end of the thermoelectromotive force generator to the second conductor;
• and
• wherein at least one of the first and second wires are formed integrally together with one of the first and second conductors.

A semiconductor device for nondestructive inspection, comprising:

• a first conductor being formed on a substrate;
• a second conductor being formed on the substrate in proximity to the first conductor;
• a thermoelectromotive force generator being formed, on the substrate;
• a first wire for connecting a first end of the thermoelectromotive force generator to the first conductor;
• a second wire for connecting a second end of the thermoelectromotive force generator to the second conductor;
• and
• wherein the thermoelectromotive force generator is arranged at a position, at which a laser beam irradiated on a back of the substrate reaches without being interrupted by a structural element.

A semiconductor integrated circuit comprising:

• a n-layer wire (where “n” is an integer arbitrarily selected) formed on a substrate;
• a (n+1)-layer wire formed above the n-layer wire via an insulating layer;
• a circuit via for connecting the n-layer wire and the (n+1)-layer wire together;
• and
• at least one inspection via formed on the n-layer wire, wherein the inspection via is connected to the n-layer wire but is not connected to the (n+1)-layer wire.

A semiconductor integrated circuit comprising:

• a n-layer wire (where “n” is an integer arbitrarily selected) formed on a substrate;
• a (n+1)-layer wire formed above the n-layer wire via an insulating layer;
• at least two inspection vias formed on the n-layer wire,
• wherein the inspection vias are connected to the n-layer wire but are not connected to the (n+1)-layer wire, and
• wherein no circuit via for connecting the n-layer wire and the (n+1)-layer wire together is provided on the n-layer wire having the inspection vias.

A semiconductor device chip comprising:

• a silicon substrate;
• a first-layer wire formed above the substrate;
• a contact portion for connecting the first-layer wire to a diffusion layer formed on the substrate;
• a circuit via formed on a first end portion of the first-layer wire;
• an inspection via formed on a second end portion of the first-layer wire;
• and
• a metal film, which is formed in a relatively broad range of a surface area and a selected area of which is used for formation of a second-layer wire,
• wherein the first end portion of the first-layer wire is connected to the metal film, corresponding to the formation of the second-layer wire, by the circuit via, while the second end portion of the first-layer wire is temporarily connected to the metal film, which does not correspond to the formation of the second-layer wire, by the inspection via.