Integrated optoelectronic device and method for making same

A method for making an integrated optoelectronic device, comprising the steps of;

• providing a substrate;
• providing at least one optoelectronic component on the substrate;
• and
• providing at least one sol-gel glass waveguide on the substrate and optically connected to the at least one optoelectronic device;
• wherein the step of providing the at least one optoelectronic component on the substrate comprises etching a recess in the substrate to a depth less than the thickness of the at least one optoelectronic component, and affixing the at least one optoelectronic component in the recess so that an upper surface of the at least one optoelectronic component extends above an upper surface of the substrate;
• and wherein the method further comprises the step of forming a vertical alignment layer over the substrate with a thickness sufficient to allow the upper surface of the at least one optoelectronic component to extend above an upper surface of the vertical alignment layer.

A method for making an integrated optoelectronic device, comprising the steps of:

• providing a substrate;
• providing at least one optoelectronic component on the substrate;
• and
• providing at least one sol-gel glass waveguide on the substrate and optically connected to the at least one optoelectronic device;
• and
• forming a vertical alignment layer over the substrate with a thickness sufficient to allow the upper surface of the at least one optoelectronic component to extend above an upper surface of the vertical alignment layer, said step of providing the vertical alignment layer with the thickness sufficient to allow the upper surface of the at least one optoelectronic component to extend above the upper surface of the vertical alignment layer comprising the steps of:
• flattening the upper surface of the vertical alignment layer after it is formed over the substrate;
• etching the vertical alignment layer over the substrate until the upper surface of the optoelectronic component is exposed;
• and
• performing a timed etch to provide the vertical alignment layer with the thickness sufficient to allow the upper surface of the at least one optoelectronic component to extend above the upper surface of the vertical alignment layer.

A method for making an integrated optoelectronic device, comprising the steps of:

• providing a substrate;
• providing at least one optoelectronic component on the substrate;
• and
• providing at least one sol-gel glass waveguide on the substrate and optically connected to the at least one optoelectronic device;
• and
• forming a vertical alignment layer over the substrate with a thickness sufficient to allow the upper surface of the at least one optoelectronic component to extend above an upper surface of the vertical alignment layer, said step of providing the at least one waveguide on the substrate comprising coating a sol over the upper surface of the vertical alignment layer, curing the sol to provide a sol-gel glass layer, and patterning the sol-gel to provide the at least one waveguide.