Inspection of solder bump lighted with rays of light intersecting at predetermined angle
AssigneeNEC Electronics Corporation
InventorsMasahiko Inoue, Hiroshi Ikeda
Life of this patent
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Abstract
A bump inspecting apparatus lights a spherical solder bump mounted on the surface of a circuit board and has a reinforcing resin applied to the lower half thereof from all circumferential directions with rays of light which intersect at a predetermined angle. An image of the lighted solder bump is captured while the amount of light irradiated upon the central portion of a solder bump is reduced. An object is extracted from image data obtained by the image capture and the area and/or the aspect ratio of the object are confirmed. The quality of the state of the reinforcing resin applied to the solder bump can be inspected.
Claims7
An image processing apparatus comprising:
- image converting means for converting multilevel image data of a spherical solder bump into binary form, said bump having a reinforcing resin applied to the lower half, mounted on the surface of a circuit board;
- object extracting means for extracting an object corresponding to the portion of a solder bump exposed above the reinforcing resin from the binary image data by said image converting means;
- and
- quality determining means for determining whether the object extracted by said object extracting means is good or bad,
- said quality determining means including:
- ratio detecting means for detecting the aspect ratio of the object extracted by said object extracting means;
- and
- ratio comparing means for comparing the aspect ratio detected by said ratio detecting means with a predetermined tolerance.
Dependencies are inferred from the claim text.