Dielectric material including particulate filler
AssigneeTPL, Inc.
InventorsWilliam F. Hartman, Kirk M. Slenes, Kristen J. Law
Life of this patent
Estimating the term…
Abstract
A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from −55 to 125° C.
Claims18
A composite comprising at least one organic polymer having a Tg greater than about 140° C., and at least one particle filler comprising non-refractory ferroelectric particles, said ferroelectric particles having a cubic crystalline structure, wherein the particle size is substantially in the range of between approximately 20 and 150 nanometers, and the dielectric constant of the composite varies less than 15% when the composite is subjected to a temperature of from −55 to 125° C.
Dependencies are inferred from the claim text.