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US 6,608,752 B2Granted
Adaptive heat sink for electronics applications
AssigneeGeneral Electric Company
InventorsGarron Koch Morris, Kamlesh Mundra
Life of this patent
Estimating the term…
Abstract
A heat sink for a compact, integral lamp system comprises a bimetal strip or a bimetal heat pipe containing a liquid. With temperature change, the bimetal strip or pipe flexes toward one metal or the other, depending on the physical properties of the particular metals. The deformation of the strip causes heat sink fins to press against the surface of the ballast wall, thereby significantly reducing or eliminating the air gaps therebetween and thus more effectively removing heat from the ballast.
Claims4
A heat sink system for an electronic system, comprising:
- a heat pipe comprising a container comprising at least two metal portions attached together at two ends and having a space therebetween for holding a liquid, the metal portions each having predetermined thermal characteristics, the heat pipe being situated adjacent to the electronic system and being configured such that in operation of the electronic system, the heat pipe reconfigures, in response to heat generated by the electronic system, so as to conduct heat away from the electronic system and causing the liquid to tend to boil at one end of the heat pipe and condense at the other end and result in a transfer of heat to a heat sink.
Dependencies are inferred from the claim text.