Temperature compensated crystal oscillator package
AssigneeCTS Corporation
InventorsJames L. Stolpman, Mark D. Schrepferman
Life of this patent
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Abstract
An improved temperature compensated quartz oscillator, which includes a package for mounting compensating circuitry over a cavity instead of on a planar layer, reduces the chip failure rate by preventing undesired contact of the compensation circuitry with the material forming the layer upon which the circuitry is mounted.
Claims20
A temperature compensated crystal oscillator (TCXO) providing at least one, substantially constant-frequency output signal comprising:
- a housing formed from a plurality of discrete layers, said housing having at least a circuit carrier layer, said circuit carrier layer having first and second sides, a predetermined thickness and an included circuit cavity formed in said circuit carrier layer, said included circuit cavity being formed in said circuit carrier layer, to extend through at least said first side toward said second side and of a sufficient depth and area so as to be able to accommodate a substantially planar integrated circuit attached to said first side of said carrier layer.
A temperature compensated crystal oscillator (TCXO) comprising:
- a housing formed from a plurality of discrete functional layers comprised of:
- a crystal cavity layer having a first side and a second side and an included cavity for receiving a resonator device;
- a crystal mounting layer having a first side and a second side attached to the first side of said crystal cavity layer;
- an integrated circuit carrier layer having a first and a second side attached to the first side of said tuning capacitor layer and further including a cavity formed through said first side and extending into said carrier layer substantially through said carrier layer;
- an integrated circuit attached to said first side of said integrated circuit carrier layer and substantially over said cavity formed through said first side;
- a cover layer formed to substantially conform to the first side of said integrated circuit carrier layer and said integrated circuit so as to substantially seal said integrated circuit.
A radio communications device comprised of:
- a frequency-selective radio device that is capable of receiving and demodulating radio frequency signals according to a reference frequency signal input to said frequency-selective radio device;
- a temperature compensated crystal oscillator (TCXO), said TCXO having an output port from which reference frequency signals are emitted and which is operatively coupled to said frequency-selective radio device so as to supply a reference frequency signal to said frequency-selective radio device, said TCXO comprised of:
- a housing formed from a plurality of discrete layers, said housing having at least a circuit carrier layer, said circuit carrier layer having first and second sides, a predetermined thickness and an included circuit cavity formed in said circuit carrier layer, said included circuit cavity being formed in said circuit carrier layer, to extend through at least said first side toward said second side.
A method of manufacturing a temperature compensated crystal oscillator (TCXO) comprising the steps of:
- forming a housing from a plurality of separate layers, including:
- a first layer having a cavity to accept therein a crystal resonator;
- an integrated circuit carrier layer having a first side and a second side and a cavity formed in said integrated circuit carrier layer to extend at least through said first side and sized to accept in said cavity in said carrier layer, at least a portion of an integrated circuit that includes circuitry to control at least the frequency of signals output from said TCXO on an output terminal.
Dependencies are inferred from the claim text.