Wirebonded semiconductor package structure and method of manufacture

A method for manufacturing a wirebonded semiconductor package structure, the method comprising:

• wirebonding a die to a semiconductor package substrate to form a semiconductor package structure that includes:
• the die;
• the semiconductor package substrate;
• and
• at least one wirebond electrically connecting the die to the semiconductor package substrate;
• applying a first insulating encapsulant layer to the semiconductor package structure at least partially encapsulating the wirebond;
• applying a conductor layer on the first insulating encapsulant layer, the conductor layer electrically connected to the semiconductor package substrate, thereby creating a wirebonded semiconductor package structure;
• and
• patterning the conductor layer with a laser to form a patterned conductor layer that is electrically connected to the semiconductor package substrate.

A method for manufacturing a wirebonded semiconductor package structure, the method comprising:

• wirebonding a die to a semiconductor package substrate to form a semiconductor package structure that includes:
• the die;
• the semiconductor package substrate;
• and
• at least one wirebond electrically connecting the die to the semiconductor package substrate;
• applying a first insulating encapsulant layer to the semiconductor package structure at least partially encapsulating the wirebond;
• and
• applying a conductor layer on the first insulating encapsulant layer, the conductor layer electrically connected to the semiconductor package substrate, thereby creating a wirebonded semiconductor package structure, wherein the conductor layer is electrically connected to a ground connection of the semiconductor package substrate.

A method for manufacturing a wirebonded semiconductor package structure, the method comprising:

• wirebonding a die to a semiconductor package substrate to form a semiconductor package structure that includes:
• the die;
• the semiconductor package substrate;
• and
• at least one wirebond electrically connecting the die to the semiconductor package substrate;
• applying a first insulating encapsulant layer to the semiconductor package structure at least partially encapsulating the wirebond;
• and
• applying a conductor layer on the first insulating encapsulant layer, the conductor layer electrically connected to the semiconductor package substrate, thereby creating a wirebonded semiconductor package structure, wherein the conductor layer is electrically connected to a power source connection of the semiconductor package substrate.

A method for manufacturing a wirebonded semiconductor package structure, the method comprising:

• wirebonding a die to a semiconductor package substrate to form a semiconductor package structure that includes:
• the die;
• the semiconductor package substrate;
• and
• at least one wirebond electrically connecting the die to the semiconductor package substrate;
• applying a first insulating encapsulant layer to the semiconductor package structure at least partially encapsulating the wirebond;
• and
• applying a conductor layer on the first insulating encapsulant layer, the conductor layer electrically connected to the semiconductor package substrate, thereby creating a wirebonded semiconductor package structure, wherein the conductor layer is electrically connected to an electrical signal connection of the semiconductor package substrate.

A wirebonded semiconductor package structure comprising:

• a semiconductor device;
• a semiconductor package substrate;
• at least one wirebond electrically connecting the semiconductor device to the semiconductor package substrate;
• a first insulating encapsulant layer at least partially encapsulating the wirebond, the first encapsulating layer having thickness in the range of 3 microns to 50 microns;
• and
• a conductor layer disposed on the first insulating encapsulant layer and electrically connected to the semiconductor package substrate.

A wirebonded semiconductor package structure comprising:

• a semiconductor device;
• a semiconductor package substrate;
• at least one wirebond electrically connecting the semiconductor device to the semiconductor package substrate;
• a first insulating encapsulant layer at least partially encapsulating the wirebond;
• a conductor layer disposed on the first insulating encapsulant layer and electrically connected to the semiconductor package substrate;
• and
• a second insulating encapsulant layer disposed on the patterned conductor layer.

A wirebonded semiconductor package structure comprising:

• a semiconductor device;
• a semiconductor package substrate;
• at least one electrically connecting the semiconductor device to the semiconductor package substrate;
• a first insulating encapsulant layer at least partially encapsulating the wirebond;
• a conductor layer disposed on the first insulating encapsulant layer and electrically connected to the semiconductor package substrate, wherein the conductor layer is electrically connected to a ground connection of the semiconductor package substrate.