Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate

A support substrate used to form a semiconductor device, together with a semiconductor chip provided on the support substrate, comprising:

• a support member having first and second major surfaces and an elongate hole extending between the first and second major surfaces, the hole having first and second edges opposite to each other;
• a plurality of first external connection terminals provided along the first edge of the hole, the first external connection terminals each having one end located above the second major surface of the support member;
• a plurality of second external connection terminals provided along the first edge of the hole, the first external connection terminals each having one end located above the second major surface of the support member;
• a plurality of second external connection terminals provided along the second edge of the hole, the second external connection terminals each having one end located above the second major surface of the support member;
• and
• first and second connection wires formed of a conductive material, the first and second connection wires having respective first ends connected to the one ends of first and second external connection terminals respectively, and second ends located above the hole, the first and second connection wires being alternately arranged above the hole.