Semiconductor chip package having one or more sealing screws

A semiconductor chip package, comprising:

• a substrate having upper and lower surfaces,
• a chip flip-chip bonded to the upper surface of said substrate;
• a plurality of external connection terminals extending from the lower surface of said substrate and electrically connected to said chip;
• a lid attached to the upper surface of said substrate, said lid comprising a cavity for receiving said chip on a lower surface, the lid including one or more venting holes formed therethrough;
• and
• a sealing screw for hermetically sealing said venting holes, the screw being fixed within the holes.

A semiconductor chip package, comprising:

• a substrate having an upper and a lower surfaces,
• a chip flip-chip bonded to the upper surface of said substrate;
• a plurality of capacitors flip-chip bonded to the upper surface of said substrate around said chip;
• a plurality of external connection terminals extending from the lower surface of said substrate and electrically connected to said chip;
• a lid attached to the upper surface of said substrate, said lid comprising a cavity for receiving said chip and said capacitors on a lower surface, the lid including one or more venting holes penetrating therethrough and at least one notch;
• a sealing screw for hermetically sealing said venting holes, and
• heat sink-attaching screws for providing a connection to a heat sink, a head portion of said heat sink-attaching screw being disposed within said notch.